| 2026-08-22 |
KWEO111040106433 |
|
278.0 kg |
820411
|
CARDBOARD BOX (3926.90) |
| 2026-08-22 |
KWEO111040110994 |
|
3824.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
| 2026-08-22 |
NXGWTYODRG46324 |
S E H AMERICA INC |
5800.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2026-08-17 |
KWEO111040110983 |
|
5336.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
| 2026-08-09 |
KWEO111040107461 |
|
7380.0 kg |
381800
|
SILICON WAFER DOPED (3818.00) SILICON WAFER DOPED (3818.00) |
| 2026-08-09 |
KWEO111040106083 |
|
1819.0 kg |
820411
|
CARDBOARD BOX (3926.90) |
| 2026-08-09 |
KWEO111040106621 |
|
42.0 kg |
845490
|
PARTS FOR INGOT PULLER (7020.00) |
| 2026-08-09 |
NXGWTYODPV12521 |
S E H AMERICA INC |
5800.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2026-08-02 |
KWEO111040107450 |
|
5162.0 kg |
381800
|
SILICON WAFER DOPED (3818.00) |
| 2026-08-02 |
NXGWTYODPL65752 |
S E H AMERICA INC |
2900.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2026-07-24 |
KWEO111040107446 |
|
2262.0 kg |
720250
|
SILICON WAFER (3818.00) |
| 2026-07-24 |
KWEO111040106072 |
|
1559.0 kg |
720221
|
SILICON SQUARE COLUMN (3926.90) |
| 2026-07-18 |
NXGWTYODPA03261 |
S E H AMERICA INC |
3770.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2026-07-11 |
KWEO111040103843 |
SEH AMERICA INC |
8256.0 kg |
391590
|
PLASTICS (3923.10) PLASTICS (3923.10) |
| 2026-07-11 |
KWEO111040105335 |
|
4506.0 kg |
720250
|
SILICON WAFER (3818.00) |
| 2026-07-11 |
KWEO111040125156 |
|
2090.0 kg |
820411
|
CARDBOARD BOX (3926.90) CARDBOARD BOX (3926.90) |
| 2026-07-05 |
KWEO111040105324 |
|
5876.0 kg |
381800
|
SILICON WAFER DOPED (3818.00) |
| 2026-07-05 |
NXGWTYODNL30315 |
S E H AMERICA INC |
2900.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2026-06-28 |
KWEO111040105313 |
|
1891.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
| 2026-06-28 |
KWEO111040125145 |
|
363.0 kg |
820411
|
CARDBOARD BOX (3926.90) |
| 2026-06-22 |
KWEO111040105302 |
|
3230.0 kg |
381800
|
SILICON WAFER DOPED (3818.00) |
| 2026-06-22 |
NXGWTYODND96873 |
S E H AMERICA INC |
5779.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2026-06-14 |
KWEO111040105280 |
|
4849.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
| 2026-06-14 |
KWEO111040124972 |
|
718.0 kg |
710410
|
QUARTZ CONE (7020.00) |
| 2026-06-04 |
KWEO111040103143 |
|
5537.0 kg |
381800
|
SILICON WAFER DOPED (3818.00) |
| 2026-06-04 |
NXGWTYODMR93586 |
S E H AMERICA INC |
11437.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS D |
| 2026-06-01 |
KWEO111040103132 |
|
4579.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
| 2026-06-01 |
NXGWTYODMP45473 |
S E H AMERICA INC |
5785.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2026-06-01 |
KWEO111040124961 |
|
451.0 kg |
820411
|
CARDBOARD BOX (2804.61) |
| 2026-05-15 |
KWEO111040104473 |
|
4196.0 kg |
381800
|
SILICON WAFER DOPED (3818.00) |
| 2026-05-15 |
KWEO111040077173 |
|
274.0 kg |
820411
|
CARDBOARD BOX (3926.90) |
| 2026-05-15 |
NXGWTYODLW50181 |
S E H AMERICA INC |
2882.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2026-05-12 |
KWEO111040099713 |
SEH AMERICA INC |
8256.0 kg |
392310
|
PLASTICS, BOXES, CASES, CRATES (3923.10) PLASTICS, BOXES, CASES, CRATES (3923.10) |
| 2026-05-12 |
NXGWTYODLS26463 |
S E H AMERICA INC |
5683.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2026-05-12 |
KWEO111040100973 |
|
5383.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
| 2026-05-05 |
KWEO111040100962 |
S E H AMERICA INC |
5694.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
| 2026-04-28 |
NXGWTYODLG20020 |
S E H AMERICA INC |
5637.0 kg |
381800.0
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2026-04-28 |
KWEO111040100951 |
S E H AMERICA INC |
4928.0 kg |
381800.0
|
SILICON WAFER DOPED (.) |
| 2026-04-20 |
NXGWTYODKZ97051 |
S E H AMERICA INC |
14500.0 kg |
381800.0
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS D |
| 2026-04-20 |
KWEO111040100940 |
S E H AMERICA INC |
4976.0 kg |
381800.0
|
SILICON WAFER DOPED (.) |
| 2026-04-20 |
KWEO111040077151 |
S E H AMERICA INC |
258.0 kg |
820411.0
|
CARDBOARD BOX (.) |
| 2026-04-13 |
KWEO111040099455 |
SEH AMERICA INC |
8256.0 kg |
391590.0
|
PLASTICS (.) PLASTICS (.) |
| 2026-04-10 |
KWEO111040100030 |
S E H AMERICA INC |
5373.0 kg |
381800.0
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (.) |
| 2026-03-31 |
KWEO111040099046 |
S E H AMERICA INC |
5085.0 kg |
381800.0
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (.) |
| 2026-03-24 |
KWEO111040076941 |
S E H AMERICA INC |
177.0 kg |
820411.0
|
CARDBOARD BOX (.) |
| 2026-03-24 |
KWEO111040099035 |
S E H AMERICA INC |
2071.0 kg |
381800.0
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (.) |
| 2026-03-24 |
NXGWTYODKG16503 |
S E H AMERICA INC |
5800.0 kg |
381800.0
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2026-03-18 |
KWEO111040099024 |
S E H AMERICA INC |
2876.0 kg |
381800.0
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (.) |
| 2026-03-18 |
NXGWTYODKA56576 |
S E H AMERICA INC |
5800.0 kg |
381800.0
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2026-03-18 |
KWEO111040081421 |
SEH AMERICA INC |
8256.0 kg |
391590.0
|
PLASTICS (.) PLASTICS (.) |