| 2025-12-30 |
KWEO111040072881 |
SEH AMERICA INC |
8256.0 kg |
391590.0
|
PLASTICS ( . ) PLASTICS ( . ) |
| 2025-12-30 |
KWEO111040078481 |
S E H AMERICA INC |
5625.0 kg |
720250.0
|
SILICON WAFER ( . ) |
| 2025-12-30 |
NXGWTYODGP49382 |
S E H AMERICA INC |
4205.0 kg |
381800.0
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2025-12-20 |
KWEO111040078470 |
S E H AMERICA INC |
5396.0 kg |
720250.0
|
SILICON WAFER ( . ) |
| 2025-12-19 |
KWEO111040076554 |
SEH AMERICA INC |
8256.0 kg |
391590.0
|
PLASTICS ( . ) PLASTICS ( . ) |
| 2025-12-19 |
KWEO111040077582 |
S E H AMERICA INC |
5461.0 kg |
381800.0
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS ( . ) |
| 2025-12-19 |
NXGWTYODFK07013 |
S E H AMERICA INC |
3604.0 kg |
381800.0
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2025-12-08 |
KWEO111040029304 |
S E H AMERICA INC |
11416.0 kg |
720250.0
|
SILICON WAFER ( . ) SILICON WAFER ( . ) |
| 2025-12-08 |
NXGWTYODFK06033 |
S E H AMERICA INC |
5779.0 kg |
381800.0
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2025-12-08 |
KWEO111040029363 |
S E H AMERICA INC |
1117.0 kg |
820411.0
|
CARDBOARD BOX CUSHION ( . ) |
| 2025-12-04 |
KWEO111040029293 |
S E H AMERICA INC |
5407.0 kg |
381800.0
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS ( . ) |
| 2025-11-21 |
KWEO111040029352 |
S E H AMERICA INC |
1033.0 kg |
720250.0
|
SILICON SQUARE COLUMN ( . ) |
| 2025-11-21 |
NXGWTYODFK04202 |
S E H AMERICA INC |
5800.0 kg |
381800.0
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2025-11-15 |
KWEO111040029260 |
S E H AMERICA INC |
5153.0 kg |
381800.0
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS ( . ) |
| 2025-11-08 |
KWEO111040029024 |
S E H AMERICA INC |
5742.0 kg |
381800.0
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS ( . ) |
| 2025-11-08 |
KWEO111040029201 |
SEH AMERICA INC |
8256.0 kg |
391590.0
|
PLASTICS ( . ) PLASTICS ( . ) |
| 2025-11-08 |
KWEO111040074782 |
S E H AMERICA INC |
746.0 kg |
820411.0
|
CARDBOARD BOX CUSHION ( . ) |
| 2025-11-08 |
NXGWTYODES38233 |
S E H AMERICA INC |
2302.0 kg |
381800.0
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2025-11-06 |
NXGWTYODEZ54396 |
|
1553.0 kg |
381800.0
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2025-10-31 |
KWEO111040029013 |
S E H AMERICA INC |
11343.0 kg |
381800.0
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS ( . ) SILICON WAFER DOPED FOR USE IN ELECTRONICS ( . ) |
| 2025-10-31 |
NXGWTYODES36634 |
S E H AMERICA INC |
5800.0 kg |
381800.0
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2025-10-26 |
KWEO111040029002 |
S E H AMERICA INC |
11601.0 kg |
381800.0
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS ( . ) SILICON WAFER DOPED FOR USE IN ELECTRONICS ( . ) |
| 2025-10-26 |
KWEO111040074771 |
S E H AMERICA INC |
741.0 kg |
820411.0
|
CARDBOARD BOX CUSHION ( . ) |
| 2025-10-18 |
NXGWTYODEH42644 |
S E H AMERICA INC |
5776.0 kg |
381800.0
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2025-10-18 |
KWEO111040028991 |
S E H AMERICA INC |
10840.0 kg |
381800.0
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS ( . ) SILICON WAFER DOPED FOR USE IN ELECTRONICS ( . ) |
| 2025-10-13 |
KWEO111040028685 |
S E H AMERICA INC |
8564.0 kg |
381800.0
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS ( . ) SILICON WAFER DOPED FOR USE IN ELECTRONICS ( . ) |
| 2025-10-13 |
KWEO111040017522 |
S E H AMERICA INC |
535.0 kg |
820411.0
|
CARDBOARD BOX CUSHION ( . ) |
| 2025-10-06 |
NXGWTYODDW59485 |
S E H AMERICA INC |
8700.0 kg |
381800.0
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS D |
| 2025-10-06 |
KWEO111040028766 |
SEH AMERICA INC |
8256.0 kg |
391590.0
|
PLASTICS ( . ) PLASTICS ( . ) |
| 2025-10-06 |
KWEO111040028674 |
S E H AMERICA INC |
5355.0 kg |
381800.0
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS ( . ) |
| 2025-09-27 |
KWEO111040017511 |
S E H AMERICA INC |
364.0 kg |
820411.0
|
CARDBOARD BOX ( . ) |
| 2025-09-27 |
KWEO111040028663 |
S E H AMERICA INC |
5984.0 kg |
381800.0
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS ( . ) |
| 2025-09-27 |
NXGWTYODDR48525 |
S E H AMERICA INC |
5800.0 kg |
381800.0
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2025-09-24 |
NXGWTYODDN97136 |
|
1236.0 kg |
381800.0
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2025-09-20 |
NXGWTYODDC26872 |
S E H AMERICA INC |
5767.0 kg |
381800.0
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2025-09-20 |
KWEO111040028652 |
S E H AMERICA INC |
11399.0 kg |
381800.0
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS ( . ) SILICON WAFER DOPED FOR USE IN ELECTRONICS ( . ) |
| 2025-09-14 |
KWEO111040024334 |
SEH AMERICA INC |
8256.0 kg |
391590.0
|
PLASTICS ( . ) PLASTICS ( . ) |
| 2025-09-14 |
KWEO111040017415 |
S E H AMERICA INC |
1276.0 kg |
860800.0
|
UPS(PULLER CONTROL PARTS) ( . ) |
| 2025-09-11 |
KWEO111040024091 |
S E H AMERICA INC |
4055.0 kg |
381800.0
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS ( . ) |
| 2025-08-31 |
KWEO111040024080 |
S E H AMERICA INC |
11201.0 kg |
381800.0
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS ( . ) SILICON WAFER DOPED FOR USE IN ELECTRONICS ( . ) |
| 2025-08-31 |
NXGWTYODCB40406 |
S E H AMERICA INC |
2900.0 kg |
381800.0
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2025-08-28 |
NXGWTYODBX40716 |
S E H AMERICA INC |
7250.0 kg |
381800.0
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS D |
| 2025-08-28 |
KWEO111040017345 |
S E H AMERICA INC |
1118.0 kg |
820411.0
|
CARDBOARD BOX CUSHION ( . ) |
| 2025-08-28 |
KWEO111040024076 |
S E H AMERICA INC |
5173.0 kg |
381800.0
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS ( . ) |
| 2025-08-22 |
KWEO111040017404 |
|
1498.0 kg |
720250
|
SILICON WAFER (3818.00) |
| 2025-08-21 |
KWEO111040026600 |
S E H AMERICA INC |
3525.0 kg |
903300
|
PARTS FOR PULLER (8486.90) |
| 2025-08-17 |
KWEO111040024065 |
S E H AMERICA INC |
5173.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
| 2025-08-17 |
NXGWTYODBX35315 |
S E H AMERICA INC |
5800.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2025-08-09 |
KWEO111040017194 |
S E H AMERICA INC |
629.0 kg |
820411
|
CARDBOARD BOX CUSHION (3926.90) |
| 2025-08-09 |
KWEO111040023844 |
S E H AMERICA INC |
4701.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |