| 2025-10-30 |
NXGWYOKDET77432 |
SENJU COMTEK CORP |
2010.0 kg |
845610.0
|
ELECTRIC (INCLUDING ELECTRICALLY HEATED GAS),LASER OR OTHER LIGHT OR PHOTON BEAM, ULTRASO NIC, ELECTRON BEAM, MAGNETIC PULSE OR PLASMA |
| 2025-10-23 |
ECUWTYOELP00443 |
LEVITON MANUFACTURING CO INC |
200.0 kg |
845230.0
|
SOLDER RECYCLE MACHINE HS CODE . |
| 2025-10-08 |
NXGWYOKDCZ97122 |
SENJU COMTEK CORP |
340.0 kg |
711411.0
|
SILVER (INCLUDING SILVER PLATED WITH GOLD OR PLATINUM), UNWROUGHT OR IN SEMI-MANUFACTURED FORMS, OR IN POWDER FORM. |
| 2025-09-30 |
NXGWYOKDDV21392 |
SENJU COMTEK CORP |
1820.0 kg |
854389.0
|
MACHINES AND MECHANICAL APPLIANCES HAVING INDIVIDUAL FUNCTIONS, NOT SPECIFIED OR INCLUDED ELSEWHERE IN THIS CHAPTER. |
| 2025-09-16 |
NXGWYOKDCL94712 |
SENJU COMTEK CORP |
3762.0 kg |
711411.0
|
SILVER (INCLUDING SILVER PLATED WITH GOLD OR PLATINUM), UNWROUGHT OR IN SEMI-MANUFACTURED FORMS, OR IN POWDER FORM. |
| 2025-09-10 |
NNRG14010004782 |
SENJU AMERICA INC |
3053.0 kg |
848330.0
|
PLAIN SHAFT BEARING |
| 2025-09-10 |
MLOVMLGAS0011820 |
SENJU COMTEK CORP |
2952.0 kg |
252520.0
|
SOLDER POWDER HS CODE: . |
| 2025-08-17 |
NXGWYOKDCE66811 |
SENJU COMTEK CORP |
4930.0 kg |
845610
|
ELECTRIC (INCLUDING ELECTRICALLY HEATED GAS),LASER OR OTHER LIGHT OR PHOTON BEAM, ULTRASO NIC, ELECTRON BEAM, MAGNETIC PULSE OR PLASMA |
| 2025-08-05 |
NXGWYOKDBB63216 |
SENJU COMTEK CORP |
5816.0 kg |
711411
|
SILVER (INCLUDING SILVER PLATED WITH GOLD OR PLATINUM), UNWROUGHT OR IN SEMI-MANUFACTURED FORMS, OR IN POWDER FORM. |
| 2025-07-30 |
MLOVMLGAS0011414 |
SENJU AMERICA INC |
320.0 kg |
740620
|
CU NUGGET HS CODE:7406.20 |
| 2025-07-16 |
NXGWYOKDBH89322 |
SENJU AMERICA INC |
4380.0 kg |
851440
|
INDUSTRIAL OR LABORATORY ELECTRIC FURNACES AND OVENS (INCLUDING THOSE FUNCTIONING BY INDUCTION OR DIELECTRIC LOSS); OTHER INDUSTRIAL OR |
| 2025-07-09 |
NXGWYOKCZY88775 |
SENJU COMTEK CORP |
3656.0 kg |
711411
|
SILVER (INCLUDING SILVER PLATED WITH GOLD OR PLATINUM), UNWROUGHT OR IN SEMI-MANUFACTURED FORMS, OR IN POWDER FORM. |
| 2025-07-02 |
NNRG14010004723 |
SENJU AMERICA INC |
3046.0 kg |
848330
|
PLAIN SHAFT BEARING |
| 2025-07-02 |
MLOVMLGAS0008907 |
SENJU COMTEK CORP |
5016.0 kg |
710610
|
SOLDER POWDER HS CODE:7106.10, 8007.00, 81 06.00 |
| 2025-07-02 |
NXGWYOKDAZ48410 |
SENJU AMERICA INC |
4280.0 kg |
854389
|
MACHINES AND MECHANICAL APPLIANCES HAVING INDIVIDUAL FUNCTIONS, NOT SPECIFIED OR INCLUDED ELSEWHERE IN THIS CHAPTER. |
| 2025-06-25 |
NXGWYOKDAS58843 |
SENJU COMTEK CORP |
4110.0 kg |
845610
|
ELECTRIC (INCLUDING ELECTRICALLY HEATED GAS),LASER OR OTHER LIGHT OR PHOTON BEAM, ULTRASO NIC, ELECTRON BEAM, MAGNETIC PULSE OR PLASMA |
| 2025-06-18 |
NXGWYOKDAJ20345 |
SENJU COMTEK CORP |
1960.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2025-06-11 |
MLOVMLGAS0008727 |
SENJU AMERICA INC |
363.0 kg |
761699
|
ALUMINUM LAMINATED BAG(STP-B) & ETC.HS CODE ::7616.99,8479.90,8424.90 2811.22 |
| 2025-06-10 |
NXGWYOKCYZ40935 |
SENJU COMTEK CORP |
1129.0 kg |
711411
|
SILVER (INCLUDING SILVER PLATED WITH GOLD OR PLATINUM), UNWROUGHT OR IN SEMI-MANUFACTURED FORMS, OR IN POWDER FORM. |
| 2025-06-04 |
NNRG14010004677 |
SENJU AMERICA INC |
4080.0 kg |
848330
|
PLAIN SHAFT BEARING . . |
| 2025-06-04 |
MLOVMLGAS0006774 |
SENJU COMTEK CORP |
2308.0 kg |
710610
|
SOLDER POWDER HS CODE:7106.10,8007.00 |
| 2025-05-11 |
MLOVMLGAS0005487 |
SENJU AMERICA INC |
320.0 kg |
740620
|
CU NUGGET HS CODE :7406.20 |
| 2025-05-11 |
NXGWYOKCZD61135 |
SENJU COMTEK CORP |
3737.0 kg |
845610
|
ELECTRIC (INCLUDING ELECTRICALLY HEATED GAS),LASER OR OTHER LIGHT OR PHOTON BEAM, ULTRASO NIC, ELECTRON BEAM, MAGNETIC PULSE OR PLASMA |
| 2025-05-09 |
NXGWYOKCXY38406 |
SENJU COMTEK CORP |
651.0 kg |
711411
|
SILVER (INCLUDING SILVER PLATED WITH GOLD OR PLATINUM), UNWROUGHT OR IN SEMI-MANUFACTURED FORMS, OR IN POWDER FORM. |
| 2025-05-03 |
NNRG14010004652 |
SENJU AMERICA INC |
4593.0 kg |
848330
|
PLAIN SHAFT BEARING |
| 2025-05-03 |
MLOVMLGAS0005255 |
SENJU COMTEK CORP |
2728.0 kg |
710610
|
SOLDER POWDER HS CODE : 7106.10 ,8007.00 ,8 106.00 |
| 2025-04-26 |
NXGWYOKCXW16473 |
SENJU COMTEK CORP |
5150.0 kg |
845610
|
ELECTRIC (INCLUDING ELECTRICALLY HEATED GAS),LASER OR OTHER LIGHT OR PHOTON BEAM, ULTRASO NIC, ELECTRON BEAM, MAGNETIC PULSE OR PLASMA |
| 2025-04-11 |
NXGWYOKCXF77875 |
SENJU COMTEK CORP |
3217.0 kg |
711411
|
SILVER (INCLUDING SILVER PLATED WITH GOLD OR PLATINUM), UNWROUGHT OR IN SEMI-MANUFACTURED FORMS, OR IN POWDER FORM. |
| 2025-04-05 |
MLOVMLGAS0003545 |
SENJU COMTEK CORP |
2310.0 kg |
710610
|
SOLDER POWDER HS CODE :7106.10 , 8007.00 |
| 2025-04-04 |
NNRG14010004616 |
SENJU AMERICA INC |
2564.0 kg |
848330
|
PLAIN SHAFT BEARING . . |
| 2025-03-16 |
NXGWYOKCWH68812 |
SENJU COMTEK CORP |
3036.0 kg |
711411
|
SILVER (INCLUDING SILVER PLATED WITH GOLD OR PLATINUM), UNWROUGHT OR IN SEMI-MANUFACTURED FORMS, OR IN POWDER FORM. |
| 2025-03-09 |
MLOVMLGAS0002018 |
SENJU COMTEK CORP |
3570.0 kg |
710610
|
SOLDER POWDER HS :7106.10,8007.00 |
| 2025-03-09 |
NNRG14010004565 |
SENJU AMERICA INC |
485.0 kg |
848330
|
PLAIN SHAFT BEARING . . |
| 2025-02-20 |
MLOVMLGAS0000417 |
SENJU COMTEK CORP |
4642.0 kg |
710610
|
SOLDER POWDER HS CODE:7106.10,8007.00 |
| 2025-02-13 |
NXGWYOKCVL10791 |
SENJU COMTEK CORP |
1258.0 kg |
711411
|
SILVER (INCLUDING SILVER PLATED WITH GOLD OR PLATINUM), UNWROUGHT OR IN SEMI-MANUFACTURED FORMS, OR IN POWDER FORM. |
| 2025-02-06 |
MLOVMLGAS0001340 |
SENJU COMTEK CORP |
85.0 kg |
851590
|
1PC OF TRANSFER RAIL 1600C088R0(A)F & ETC. HS CODE:8515.90 |
| 2025-01-29 |
MLOVMLG000070628 |
SENJU AMERICA INC |
343.0 kg |
761699
|
ALUMINUM LAMINATED BAG(STP-B) & ETC.HS CODE:7616.99,2811.22 , 3824.99 |
| 2025-01-18 |
NXGWYOKCTJ08771 |
SENJU COMTEK CORP |
1509.0 kg |
711411
|
SILVER (INCLUDING SILVER PLATED WITH GOLD OR PLATINUM), UNWROUGHT OR IN SEMI-MANUFACTURED FORMS, OR IN POWDER FORM. |
| 2025-01-16 |
MLGDMLGJS0000882 |
SENJU COMTEK CORP |
352.0 kg |
|
JAR |
| 2025-01-08 |
NNRG14010004487 |
SENJU AMERICA INC |
2659.0 kg |
848330
|
PLAIN SHAFT BEARING . . |
| 2025-01-08 |
MLOVMLG000069874 |
SENJU COMTEK CORP |
3353.0 kg |
800700
|
SOLDER POWDER HS CODE:8007.00,7106.10 |
| 2025-01-02 |
ECUWYOKELP00397 |
LEVITON MANUFACTURING CO INC |
195.0 kg |
847989
|
SOLDER RECYCLE MACHINE(NEW) 820 X 960 X 1,540MM 195KG 1CRATE( ) HS CODE 8479.89 |
| 2024-12-27 |
MLOVMLG000069675 |
SENJU AMERICA INC |
319.0 kg |
740620
|
CU NUGGET HS CODE:7406.20 |
| 2024-12-17 |
NXGWYOKCSP73542 |
SENJU COMTEK CORP |
1391.0 kg |
711411
|
SILVER (INCLUDING SILVER PLATED WITH GOLD OR PLATINUM), UNWROUGHT OR IN SEMI-MANUFACTURED FORMS, OR IN POWDER FORM. |
| 2024-12-10 |
NXGWYOKCTA45372 |
SENJU AMERICA INC |
270.0 kg |
841790
|
INDUSTRIAL OR LABORATORY FURNACES AND OVENS, INCLUDING INCINERATORS, NON-ELECTRIC. |
| 2024-12-05 |
MLOVMLG000068558 |
SENJU COMTEK CORP |
3519.0 kg |
800700
|
SOLDER POWDER HS CODE:8007.00,7106,10 |
| 2024-11-25 |
NNRG14010004454 |
SENJU AMERICA INC |
2026.0 kg |
848330
|
PLAIN SHAFT BEARING |
| 2024-11-24 |
NXGWYOKCRJ57220 |
SENJU COMTEK CORP |
1412.0 kg |
711411
|
SILVER (INCLUDING SILVER PLATED WITH GOLD OR PLATINUM), UNWROUGHT OR IN SEMI-MANUFACTURED FORMS, OR IN POWDER FORM. |
| 2024-11-20 |
NXGWYOKCSN30303 |
SENJU COMTEK CORP |
5306.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2024-11-17 |
MLGDMLGJS0000554 |
SENJU COMTEK CORP |
352.0 kg |
|
JAR |