| 2025-10-29 |
BWLEHKG59099832 |
KIMBALL ELECTRONICS MEXICO INC |
967.0 kg |
650510.0
|
CTNS PACKED INTO PLTSBARE PC BOARD H.S. CODE: AS PER INV NO: IOP FOB HONG KONG THIS SHIPMENT DOES NOT CONTAI N ANY WOODPACKING MATERIAL |
| 2025-10-29 |
BWLEHKG59099813 |
KIMBALL ELECTRONICS MEXICO INC |
154.0 kg |
650510.0
|
BARE PC BOARD H.S. CODE: AS PER INV NO: IOP FOB HONG KONG THIS SHI PMENT DOES NOT CONTAIN ANY WOODPACKING MATERIAL |
| 2025-10-29 |
BWLEHKG59132879 |
KIMBALL ELECTRONICS MEXICO INC |
189.0 kg |
80410.0
|
CTNS PACKED INTO PALLETBARE PC BOARDH.S. CODE: AS PER INV NO: IOP THIS SHIPMENT DOES NOT CONTAIN ANY WOODPACKING MATERIALS |
| 2025-10-29 |
BWLEHKG59133813 |
KIMBALL ELECTRONICS MEXICO INC |
348.0 kg |
80410.0
|
CTNS PACKED INTO PALLETBARE PC BOARDH.S. CODE: AS PER INV NO: IOP THIS SHIPMENT DOES NOT CONTAIN ANY WOODPACKING MATERIALS |
| 2025-10-24 |
PGCVWL6430961910 |
KANEMATSU ADVANCED MATERIALS USA I |
7429.0 kg |
441029.0
|
BARE PC BOARD HS CODE: |
| 2025-10-24 |
CHSL528716123HKG |
KIMBALL ELECTRONICS MEXICO INC |
1387.0 kg |
721633.0
|
BARE PC BOARD AS PER INV IOP H.S. CODE PLTS CARTONS |
| 2025-10-21 |
BWLEHKG59082077 |
KIMBALL ELECTRONICS MEXICO INC |
2995.0 kg |
|
CTNS |
| 2025-10-21 |
BWLEHKG59082884 |
KIMBALL ELECTRONICS MEXICO INC |
77.0 kg |
650510.0
|
BARE PC BOARD H.S. CODE: AS PER INV NO: IOP FOB HONG KONG THIS SH IPMENT DOES NOT CONTAIN ANY WOODPACKING MATERIAL |
| 2025-10-19 |
FTNVSHKGS0002902 |
SOUTH BAY CIRCUITS INC |
474.0 kg |
853890.0
|
BARE PRINTED CIRCUIT BOARD. |
| 2025-10-19 |
EXDO6911629531 |
HONEYWELL MX0H EL PASO PLANT |
89.0 kg |
853890.0
|
BARE PRINTED CIRCUIT BOARD HTS: |
| 2025-10-18 |
CHSL526647093HKG |
PLASTIC OMNIUM LIGHTING SYSTEMS US |
144.0 kg |
853890.0
|
BARE PRINTED CIRCUIT BOARD ORIGIN CHINA H.S. USA HTS , AS PER INV NO IOP PLT CTNS |
| 2025-10-16 |
BWLEHKG59049112 |
KIMBALL ELECTRONICS MEXICO INC |
1579.0 kg |
170260.0
|
CTNS PACKED INTO PALLETSBARE PC BOARDH. S. CODE: AS PER INV NO: IOP THI S SHIPMENT DOES NOT CONTAIN ANY WOODPACKING MATERIALS |
| 2025-10-08 |
BWLEHKG59037802 |
KIMBALL ELECTRONICS MEXICO INC |
2665.0 kg |
650510.0
|
CTNS PACKED INTO PLTSBARE PC BOARD H.S. CODE: AS PER INV NO: IOP FOB HONG KONG THIS SHIP MENT DOES NOT CONTAIN ANY WOODPACKING MATERIAL |
| 2025-10-08 |
BWLEHKG59037810 |
KIMBALL ELECTRONICS MEXICO INC |
157.0 kg |
650510.0
|
CTNS PACKED INTO PLTBARE PC BOARD H.S. CODE: AS PER INV NO: IOP FOB HONG KONG THIS SHIPME NT DOES NOT CONTAIN ANY WOODPACKING MATERIAL |
| 2025-10-07 |
PGCVWL6428809540 |
KANEMATSU ADVANCED MATERIALS USA I |
11689.0 kg |
441029.0
|
BARE PC BOARD |
| 2025-10-07 |
CHKMLGB25116980 |
LACROIX ELECTRONICS MI |
2232.0 kg |
441029.0
|
BARE PC BOARD HS CODE: . . . . . . |
| 2025-10-03 |
FTNVSHKGS0002830 |
SOUTH BAY CIRCUITS INC |
713.0 kg |
853890.0
|
BARE PRINTED CIRCUIT BOARD. |
| 2025-10-03 |
CHKMACEC2509033 |
LACROIX ELECTRONICS MI LLC |
534.0 kg |
721633.0
|
BARE PC BOARD H.S. CODE: AS PER INV#:IOP -IOP PALLET = CARTONS . . . . . |
| 2025-10-01 |
PGCVWL9503676610 |
KANEMATSU ADVANCED MATERIALS USA I |
15695.0 kg |
853890.0
|
BARE PC BOARD PRINTED CIRCUIT BOARDS BARE PCBCONNECTOR |
| 2025-10-01 |
CHSL526501582HKG |
EBW ELECTRONICS INC |
205.0 kg |
721633.0
|
BARE PC BOARD AS PER INV IOP H.S. CODE |
| 2025-10-01 |
UASI7809084767 |
BOURNS INC |
172.0 kg |
853400.0
|
BARE PRINTED CIRCUITS BOARD |
| 2025-10-01 |
CHKMLGB25112205 |
LACROIX ELECTRONICS MI |
848.0 kg |
611090.0
|
BARE PC BOARD FCA HONG KONG AS PER INV# IOP PLTS= CARTONS . . . . |
| 2025-10-01 |
EXDO6911629142 |
SMTC MEX HOLDINGS |
82.0 kg |
441029.0
|
BARE PC BOARD HTS: |
| 2025-09-30 |
BWLEHKG59006534 |
KIMBALL ELECTRONICS MEXICO INC |
269.0 kg |
650510.0
|
CTNS PACKED INTO PLTBARE PC BOARD H.S. CODE: AS PER INV NO: IOP FOB HONG KONG THIS SHIPME NT DOES NOT CONTAIN ANY WOODPACKING MATERIAL |
| 2025-09-17 |
BWLEHKG58945859 |
KIMBALL ELECTRONICS MEXICO INC |
586.0 kg |
650510.0
|
CTNS PACKED INTO PLTSBARE PC BOARD H.S. CODE: AS PER INV NO: IOP FOB HONG KONG THIS SHIPMENT DOES NOT CONTA IN ANY WOODPACKING MATERIAL |
| 2025-09-17 |
BWLEHKG58972060 |
KIMBALL ELECTRONICS MEXICO INC |
256.0 kg |
650510.0
|
CTNS PACKED INTO PLTBARE PC BOARD H.S. CODE: AS PER INV NO: IOP FOB HONG KONG THIS SHIPMENT DOES NOT CONTAI N ANY WOODPACKING MATERIAL |
| 2025-09-17 |
BWLEHKG58972362 |
KIMBALL ELECTRONICS MEXICO INC |
1632.0 kg |
650510.0
|
CTNS PACKED INTO PLTSBARE PC BOARD H.S. CODE: AS PER INV NO: IOP , IOP FOB HONG KONG THIS SHIPME NT DOES NOT CONTAIN ANY WOODPACKING MATERIAL |
| 2025-09-14 |
BWLEHKG58935800 |
KIMBALL ELECTRONICS MEXICO INC |
2077.0 kg |
650510.0
|
CTNS PACKED INTO PLTSBARE PC BOARD H.S. CODE: AS PER INV NO: IOP THIS SHIPMENT DOES NOT CONTAIN ANY WOODPAC KING MATERIAL |
| 2025-09-14 |
BWLEHKG58914465 |
KIMBALL ELECTRONICS MEXICO INC |
1011.0 kg |
650510.0
|
CTNS PACKED INTO PLTSBARE PC BOARD H.S. CODE: AS PER INV NO: IOP THIS SHIPMENT DOES NOT CONTAIN ANY WO ODPACKING MATERIAL |
| 2025-09-14 |
BWLEHKG58914637 |
KIMBALL ELECTRONICS MEXICO INC |
155.0 kg |
650510.0
|
CTNS PACKED INTO PLTBARE PC BOARD H.S. CODE: AS PER INV NO: IOP FOB HONG KONG THIS SHIPME NT DOES NOT CONTAIN ANY WOODPACKING MATERIAL |
| 2025-09-14 |
CHSL523158615HKG |
PLASTIC OMNIUM LIGHTING SYSTEMS US |
769.0 kg |
853890.0
|
BARE PRINTED CIRCUIT BOARD ORIGIN CHINA H.S. USA HTS , AS PER INV NO IOP TOTAL PLTS CTNS |
| 2025-09-13 |
SHPT7571US186309 |
OSRAM SYLVANIA INC |
427.0 kg |
441029.0
|
BARE PC BOARD |
| 2025-09-09 |
PGCVWL6426928910 |
KANEMATSU ADVANCED MATERIALS USA I |
12990.0 kg |
853890.0
|
BARE PC BOARD PRINTED CIRCUIT BOARDS SOLENOID |
| 2025-09-09 |
CHSL524675683HKG |
EBW ELECTRONICS INC |
506.0 kg |
721633.0
|
BARE PC BOARD AS PER INV IOP H.S. CODE |
| 2025-09-03 |
UASI7809079608 |
BOURNS INC |
172.0 kg |
853400.0
|
BARE PRINTED CIRCUITS BOARD |
| 2025-08-26 |
EXDO6911625572 |
HONEYWELL MX0H EL PASO PLANT |
650.0 kg |
441029.0
|
BARE PC BOARD HTS: |
| 2025-08-26 |
PGCVWL6425605410 |
KANEMATSU ADVANCED MATERIALS USA I |
14855.0 kg |
853890.0
|
BARE PC BOARD PRINTED CIRCUIT BOARDS BARE PCBCONNECTOR |
| 2025-08-24 |
BWLEHKG58870763 |
KIMBALL ELECTRONICS MEXICO INC |
2936.0 kg |
840212
|
CTNS PACKED INTO PLTSBARE PC BOARDH.S. CO DE: AS PER INV NO: IOP , IOP , IOP FOB HONG KONGTHIS SHIPMEN T DOES NOT CONTAIN ANY WOODPACKING MATERIAL |
| 2025-08-24 |
BWLEHKG58892444 |
KIMBALL ELECTRONICS MEXICO INC |
265.0 kg |
650510
|
CTNS PACKED INTO PLTBARE PC BOARD H.S. CODE: AS PER INV NO: IOP FOB HONG KONG THIS SHIPMENT DOES NOT CONTAI N ANY WOODPACKING MATERIAL |
| 2025-08-24 |
EXDO6911625452 |
SMTC MEX HOLDINGS |
229.0 kg |
441029.0
|
BARE PC BOARD HTS: |
| 2025-08-24 |
CHSL522970870HKG |
KIMBALL ELECTRONICS MEXICO INC |
1255.0 kg |
721633.0
|
BARE PC BOARD AS PER INV IOP H.S. CODE PLTS CARTONS |
| 2025-08-18 |
PGCVWL6424164860 |
KANEMATSU ADVANCED MATERIALS USA I |
15638.0 kg |
441029
|
BARE PC BOARD |
| 2025-08-18 |
CHSL522388395HKG |
EBW ELECTRONICS INC |
137.0 kg |
853400
|
BARE PC BOARD AS PER INV IOP25070359 H.S. CODE 8534 00 |
| 2025-08-12 |
CHSL521451299HKG |
EBW ELECTRONICS INC |
358.0 kg |
441029
|
BARE PC BOARD |
| 2025-08-12 |
FTNVSHKGS0002559 |
SOUTH BAY CIRCUITS INC |
756.0 kg |
853890
|
BARE RINTED CIRCUIT BOARD. |
| 2025-08-09 |
BWLEHKG58834408 |
KIMBALL ELECTRONICS MEXICO INC |
1070.0 kg |
853400
|
82CTNS PACKED INTO 2PLTSBARE PC BOARD H.S. CODE: 8534 00 AS PER INV NO: IOP25 060304 FOB HONG KONG THIS SHIPMENT DOES NOT CONT AIN ANY WOODPACKING MATERIAL |
| 2025-08-06 |
BWLEHKG58810155 |
KIMBALL ELECTRONICS MEXICO INC |
514.0 kg |
853400
|
36CTNS PACKED INTO 1PLTBARE PC BOARD H.S. CODE: 8534 00 AS PER INV NO: IOP250 60113 FOB HONG KONGTHIS SHIPMENT DOES NOT CONTAIN ANY WOODPACKING MATERIAL |
| 2025-08-04 |
NAQAKGLGB630507V |
KANEMATSU ADVANCED MATERIAL USA INC |
9178.0 kg |
853669
|
BARE PC BOARD PRINTED CIRCUIT BOARDS CONNECTOR |
| 2025-08-01 |
CTYOCAN19810462 |
LACROIX ELECTRONICS MI LLC |
10804.0 kg |
441029
|
BARE PC BOARD . . |
| 2025-07-25 |
UASI7809070973 |
BOURNS INC |
172.0 kg |
853400
|
BARE PRINTED CIRCUITS BOARD |