MICRON TECHNOLOGY TAIWAN INC
Address: NO 667 FUHSING 3RD RD HWA YA TECHNOLOGY PARK GUISHAN DIST
MICRON TECHNOLOGY TAIWAN INC's Shipments Over Time
Supply Ratings
Shipment Reliability and Frequency Volume of Goods
Avg. Shipments per Month: 2.85 Average TEU per month: 7.00
Active Months: 11 Average TEU per Shipment: 2.27
Shipment Frequency Std. Dev.: 2.41
Shipments By Companies
Company Name Shipments
MICRON TECHNOLOGY INC 29 shipments
SPT MICROTECHNOLOGIES USA INC 3 shipments
TEXAS INSTRUMENTS INCORPORATED 3 shipments
TEXAS SEMICONDUCTOR TECHNOLOGIES INC 3 shipments
ALLYSEMI LLC 1 shipments
CAPITAL ASSET EXCHANGE AND TRADE 1 shipments
JTM TECHNOLOGIES INC 1 shipments
LAM RESEARCH CORP 1 shipments
Shipments By HS Code
HS Code Shipments
848620 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor devices or of electronic integrated circuits 11 shipments
470500 Wood pulp; obtained by a combination of mechanical and chemical pulping processes 4 shipments
50900.0 4 shipments
282550 Copper oxides and hydroxides 3 shipments
293723.0 Hormones, prostaglandins, thromboxanes and leukotrienes, natural or reproduced by synthesis; derivatives and structural analogues thereof, including chain modified polypeptides, used primarily as hormones. 3 shipments
845710 Machining centres; for working metal 3 shipments
854389 Electrical machines and apparatus; having individual functions, not specified or included elsewhere in this chapter 3 shipments
903180 Instruments, appliances and machines; for measuring or checking n.e.c. in chapter 90 3 shipments
760691.0 Aluminium; plates, sheets and strip, thickness exceeding 0.2mm 2 shipments
841610 Furnaces; furnace burners, for liquid fuel 2 shipments
847989 Machines and mechanical appliances; having individual functions, n.e.c. or included in this chapter 2 shipments
854389.0 Electrical machines and apparatus; having individual functions, not specified or included elsewhere in this chapter 2 shipments
903082 Instruments and apparatus; for measuring or checking semiconductor wafers or devices 2 shipments
091091 Spices; mixtures of 2 or more products of different headings 1 shipments
120925.0 Seeds, fruit and spores; of a kind used for sowing 1 shipments
270730 Oils and products of the distillation of high temperature coal tar; xylol (xylenes) 1 shipments
293430 Heterocyclic compounds; containing in the structure, a phenothiazine ring-system (whether or not hydrogenated), not further fused 1 shipments
701120.0 Glass envelopes (including bulbs and tubes), open and glass parts thereof, without fittings, for electric lamps, cathode-ray tubes or the like 1 shipments
760612.0 Aluminium; plates, sheets and strip, thickness exceeding 0.2mm 1 shipments
800200.0 Tin; waste and scrap 1 shipments
845691.0 Machine-tools; for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam, or plasma arc processes; water-jet cutting machines 1 shipments
845699 Machine-tools; for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam, or plasma arc processes; water-jet cutting machines 1 shipments
846140.0 Machine-tools; for planing, shaping, slotting, broaching, gear cutting and grinding, finishing, sawing, cutting off and other tools working by removing metal, sintered metal carbides or cermets n.e.c. 1 shipments
847149 Automatic data processing machines; presented in the form of systems, n.e.c. in item no. 8471.30 or 8471.41 1 shipments
847439.0 Machinery for sorting, screening, separating, washing, crushing, grinding, mixing or kneading earth, stone, ores in solid form, shaping, moulding machinery for solid mineral fuels 1 shipments
847989.0 Machinery and mechanical appliances; having individual functions, n.e.c. in this chapter 1 shipments
851690.0 Electric water, space, soil heaters; electro-thermic hair-dressing apparatus; hand dryers, irons; electro-thermic appliances for domestic purposes; electro heating resistors, not of heading no. 8545 1 shipments
852410 1 shipments
853224 Electrical capacitors; fixed, ceramic dielectric, multilayer 1 shipments
854311 Electrical machines and apparatus; having individual functions, not specified or included elsewhere in this chapter 1 shipments
940350 Furniture; wooden, for bedroom use 1 shipments
950320.0 Tricycles, scooters, pedal cars and similar wheeled toys; dolls' carriages; dolls; other toys; reduced-size (scale) models and similar recreational models, working or not; puzzles of all kinds 1 shipments
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Latest Shipments
Arrival Date Bill Of Lading Consignee Weight HS Code Description
2025-12-23 CNSVBKENY5112002 2132.0 kg 950320.0 OZONIZER MODEL OP- H-RE MAKER TMEIC ORIG IN JP INV P.O. MICAP / /
2025-12-01 CNSVKKLM2510039 6583.0 kg 854389.0 FCVD (FLOW ABLE CHEMICAL VAPOR DEPOSITION), MODEL PRODUCER GT MANUFACTURERAPPLIED MATERI ALS ORIGIN US TOOL IDMSPRBC INV P.O. MIICAP FCVD (FLOW ABLE CHEMICAL VAPOR DEPOSITION), MODEL PRODUCER GT MANUFACTURERAPPLIED MATERI ALS ORIGIN US TOOL IDMSPRBC INV P.O. MIICAP
2025-11-24 CNSVBKEOA5102006 5303.0 kg 845691.0 -INCH WAFER PLASMA ETCHING DRY STRIP, MODEL SUPREMA, MAKER MATTSON TOOL ID WMATB AQ ORIGIN US MICAP P.O. IN V
2025-11-24 CNSVBKEOA5102007 5084.0 kg 760612.0 ASPEN III STRIP MM SYSTEM, MODEL ASPEN II I MAKER MATTSON TECHNOLOGY, INC. TOOL ID W MATB BB ORIGIN US MICAP P.O. INV ASPEN III STRIP MM SYSTEM, MODEL ASPEN II I MAKER MATTSON TECHNOLOGY, INC. TOOL ID W MATB BB ORIGIN US MICAP P.O. INV
2025-11-17 CNSVBKHOA5102004 5287.0 kg 293723.0 AUTOMATIC METROLOGY SEM SYSTEM VERITYSEM I, MAKERAPPLIED MATERIALS MODELVERITYSEM TOOL ID AV IBCSF ORIGIN ASM US MICAP P.O. INV
2025-11-04 CNSVBKEOA5102002 15748.0 kg 760691.0 SEMI-BATCH ALD SYSTEM NT , MANUFACTURER TO KYO ELECTRON LTD. MODEL TEL NT TOOL ID T HIKB N ORIGIN JP MICAP P.O. INV SEMI-BATCH ALD SYSTEM NT , MANUFACTURER TO KYO ELECTRON LTD. MODEL TEL NT TOOL ID T HIKB N ORIGIN JP MICAP P.O. INV SEMI-BATCH ALD SYSTEM NT , MANUFACTURER TO KYO ELECTRON LTD. MODEL TEL NT TOOL ID T HIKB N ORIGIN JP MICAP P.O. INV
2025-11-04 CNSVKKLM2510028 22055.0 kg 847989.0 WET SINGLE WAFER CLEANING EQUIPMENT, MODELSU MAKERSCREEN SEMICONDUCTOR SOLUTIONS CO. , LTD TOOL ID WDNSBCXD ORIGIN JP MICAP P.O. INV WET SINGLE WAFER CLEANING EQUIPMENT, MODELSU MAKERSCREEN SEMICONDUCTOR SOLUTIONS CO. , LTD TOOL ID WDNSBCXD ORIGIN JP MICAP P.O. INV WET SINGLE WAFER CLEANING EQUIPMENT, MODELSU MAKERSCREEN SEMICONDUCTOR SOLUTIONS CO. , LTD TOOL ID WDNSBCXD ORIGIN JP MICAP P.O. INV WET SINGLE WAFER CLEANING EQUIPMENT, MODELSU MAKERSCREEN SEMICONDUCTOR SOLUTIONS CO. , LTD TOOL ID WDNSBCXD ORIGIN JP MICAP P.O. INV
2025-11-04 CNSVKKLM2510023 6722.0 kg 846140.0 -INCH WAFER PLASMA BEVEL ETCH, MODEL BEVEL, MAKER LAM RESEARCH TOOL ID WLAMB BB ORIGIN US MICAP P.O. INV
2025-10-29 PNLPDAL2510T0001 ALLYSEMI LLC 5348.0 kg 701120.0 OVERLAY MEASUREMENT, MODELARCHER A AI M
2025-10-27 CNSVBKEOA5092001 1500.0 kg 50900.0 DIELECTRIC ETCH, MODEL TELIUS SP- SCCM, T OOL ID TTDRK UB MANUFACTURER TOKYO ELECTR ON LTD. ORIGIN JP MICAP P.O. INV
2025-10-22 CNSVBKEOA5102001 15748.0 kg 760691.0 SEMI-BATCH ALD SYSTEM NT MANUFACTURER TOK YO ELECTRON LTD. MODEL TEL NT TOOL ID T HIKB N ORIGIN JP MICAP P.O. INV SEMI-BATCH ALD SYSTEM NT MANUFACTURER TOK YO ELECTRON LTD. MODEL TEL NT TOOL ID T HIKB N ORIGIN JP MICAP P.O. INV SEMI-BATCH ALD SYST
2025-10-15 CNSVBKHNY5082004 9347.0 kg 293723.0 POLY SILICON ETCHER MODELPRODUCER MAKER APP LIED MATERIALS ORIGIN SG TOOL IDAGXTB INV P.O. MICAP POLY SILICON ETCHER MODELPRODUCER MAKER APP LIED MATERIALS ORIGIN SG TOOL IDAGXTB INV P.O. MICAP
2025-10-15 CNSVBKHNY5082003 9385.0 kg 293723.0 POLY SILICON ETCHER MODELPRODUCER MAKERAPPL IED MATERIALS ORIGIN SG TOOL IDAGXTB I NV P.O. MIICAP POLY SILICON ETCHER MODELPRODUCER MAKERAPPL IED MATERIALS ORIGIN SG TOOL IDAGXTB I NV P.O. MIICAP
2025-10-15 CNSVKKLM2508040 7656.0 kg 800200.0 TIN CHEMICAL VAPOR DEPOSITION MODEL TRIAS / EXII TIN, MAKER TOKYO ELECTRON LTD. TOOL ID SNTRB T ORIGIN JP INV P.O. MICAP TIN CHEMICAL VAPOR DEPOSITION MODEL TRIAS / EXII TIN, MAKER TOKYO ELECTRON LTD. TOOL ID SNTRB T ORIGIN JP INV P.O. MICAP TIN C
2025-09-04 CNSVKKLM2508025 2550.0 kg 50900.0 OVERLAY MEASUREMENT, MAKER KLA-TENCOR CO RP., MODEL ARCHER AIM TOOL ID KA B V ORIGIN ASM IL MICAP P.O. INV
2025-09-04 CNSVKKLM2508026 2550.0 kg 50900.0 OVERLAY MEASUREMENT, MAKER KLA-TENCOR CO RP., MODEL ARCHER AIM TOOL ID KA BCV ORIGIN ASM IL MICAP P.O. INV
2025-08-30 CNSVBKEOA5082001 8505.0 kg 120925.0 METAL ETCHER, MODEL METAL, MANUFACTURER LAM RESEARCH CORPORATION TOOL ID L DOBD COUNTRY OF ORIGIN US MICAP P.O. INV METAL ETCHER, MODEL METAL, MANUFACTURER LAM RESEARCH CORPORATION TOOL ID L DOBD COUNTRY OF ORIGIN US MICAP P.O. INV
2025-08-24 CNSVBKELA5082002 15488.0 kg 50900.0 VIGUSRK ETCH MODEL TACTRAS VIGUSRK MAKER T OKYO ELECTRON LTD. TOOL ID TAVGB COUNT RY OF ORIGIN JP MICAP P.O. INV VIGUSRK ETCH MODEL TACTRAS VIGUSRK MAKER T OKYO ELECTRON LTD. TOOL ID TAVGB COUNT RY OF ORIGIN JP MICAP P.O. INV VIGUSRK ETCH MODEL TA
2025-08-24 CNSVBKELA5082001 8753.0 kg 854389.0 FCVD (FLOW ABLE CHEMICAL VAPOR DEPOSITION) MANUFACTURER APPLIED MATERIALS TOOL ID MSPRB ORIGIN US MICAP P.O. INV FCVD (FLOW ABLE CHEMICAL VAPOR DEPOSITION) MANUFACTURER APPLIED MATERIALS TOOL ID MSPRB ORIGIN US MICAP P.O. INV
2025-08-23 CNSVBKEOA5072004 5287.0 kg 847439.0 AUTOMATIC METROLOGY SEM SYSTEM VERITYSEM I, MAKERAPPLIED TOOL ID AV IB S ORIGIN US MICAP P.O. INV
2025-08-23 DMERDFS012120051 LAM RESEARCH CORP 1625.0 kg 851690.0 VIGUSRK ETCH (CHAMBER) TACTRAS VIGUSRK .
2025-08-07 CNSVBKENY5062004 2132.0 kg 293430 OZONE GAS GENERATING SYSTEM MODELOP-H-R SERI ES (OP-500H-RE1-RT) MARKER TMEIC, MODEL OP5 00H-RE1. ORIGIN JP MICAP1324165/MICAP13241 66 MICAP1323617/MICAP1323618
2025-08-07 CNSVBKEOA5072002 5287.0 kg 270730 SAID TO CONTAIN 3WDCS AUTOMATIC METROLOGY S EM SYSTEM MODELVERITYSEM 4I MAKERAPPLIED TO OL ID AV4IB7SC00 ORIGIN US MICAP1303528 P. O.3501326278 INV2007792
2025-08-07 CNSVBKEOA5072003 5342.0 kg 852410 MESA US WDC/NO1/33/3 1982596 FROM TAIWAN . . .
2025-07-10 CNSVKKLM2506022 MICRON TECHNOLOGY INC 5287.0 kg 845710 AUTOMATIC METROLOGY SEM SYSTEM VERITYSEM 4I, MAKERAPPLIED TOOL ID AV4IBCSB00 ORIGIN US MICAP1303547 P.O.3501317773 INV1993873
2025-07-10 CNSVKKLM2506025 MICRON TECHNOLOGY INC 5287.0 kg 845710 AUTOMATIC METROLOGY SEM SYSTEM VERITYSEM 4I, MAKERAPPLIED TOOL ID AV4IB7SD00 ORIGIN US MICAP1303527 P.O.3501317773 INV1998237
2025-06-28 SLCTKELOAKR6451 TEXAS SEMICONDUCTOR TECHNOLOGIES INC 11319.0 kg 282550 OXIDE ETCHER MODEL2300 EXELAN FLEX FX . OXIDE ETCHER MODEL2300 EXELAN FLEX FX . OXIDE ETCHER MODEL2300 EXELAN FLEX FX .
2025-06-15 SLCTKELOAKR5458 TEXAS SEMICONDUCTOR TECHNOLOGIES INC 11319.0 kg 282550 OXIDE ETCHER MODEL2300 EXELAN FLEX FX . OXIDE ETCHER MODEL2300 EXELAN FLEX FX . OXIDE ETCHER MODEL2300 EXELAN FLEX FX .
2025-06-15 CNSVBKEOA5052002 MICRON TECHNOLOGY INC 14561.0 kg 848620 PHOTO PROCESS TOOL MODEL LITHIUS PRO MAKER TEL TOOL ID TPROBC7D00 COUNTRY OF ORIGIN J P MICAP1306164 P.O.3501283679 INV1985021 HS CODE8486.20 PHOTO PROCESS TOOL MODEL LITHIUS PRO MAKER TEL TOOL ID TPROBC7D00 COUNTRY OF ORIGIN J P MICAP1306164 P.O.3501283679 INV1985021 HS CODE8486.20 PHOTO PROCESS TOOL MODEL LITHIUS PRO MAKER TEL TOOL ID TPROBC7D00 COUNTRY OF ORIGIN J P MICAP1306164 P.O.3501283679 INV1985021 HS CODE8486.20
2025-05-30 CNSVKKLM2505011 MICRON TECHNOLOGY INC 15748.0 kg 845699 SEMI- BATCH ALD SYSTEM NT333 12 MODEL TEL N T333 TOOL ID THIKB3N600 MANUFACTURER TOKYO ELECTRON LTD. COUNTRY OF ORIGIN JP MICAP132 3093 P.O.3501317646 INV1980156 SEMI- BATCH ALD SYSTEM NT333 12 MODEL TEL N T333 TOOL ID THIKB3N600 MANUFACTURER TOKYO EL
2025-05-07 SLCTKELOAKR4498 TEXAS SEMICONDUCTOR TECHNOLOGIES INC 11253.0 kg 282550 OXIDE ETCHER MODEL2300 EXELAN FLEX FX . OXIDE ETCHER MODEL2300 EXELAN FLEX FX . OXIDE ETCHER MODEL2300 EXELAN FLEX FX .
2025-05-07 CNSVBKEOA5042002 MICRON TECHNOLOGY INC 6480.0 kg 903082 12 THICK FILM MEASUREMENT, MODEL SPECTRAFX2 00 MAKER KLA-TENCOR CORP., MICAP1304343 TOO L ID KSFXBC0100 HS CODE 9030.82 .
2025-04-27 CNSVBKEOA5042001 MICRON TECHNOLOGY INC 5287.0 kg 845710 AUTOMATIC METROLOGY SEM SYSTEM VERITYSEM 4I MAKERAPPLIED TOOL ID AV4IB7SG00 MICAP130352 9 P.O.3501302133 INV1968848
2025-04-21 CNSVKKLM2503030 MICRON TECHNOLOGY INC 21543.0 kg 854311 VIISTA HCP MODEL HIGH CURRENT (ION IMPLANTER ) MANUFACTURER APPLIED MATERIALS INV1966040 CALM1303232 P.O.4514174291 VIISTA HCP MODEL HIGH CURRENT (ION IMPLANTER ) MANUFACTURER APPLIED MATERIALS INV1966040 CALM1303232 P.O.4514174291 VIISTA HCP MODE
2025-03-26 CNSVKKLM2502006 MICRON TECHNOLOGY INC 16000.0 kg 847989 WET SINGLE WAFER CLEANING EQUIPMENT MODEL SU -3100 TOOL ID WDNSBCXB00SWCA202 INV195184 5 MICAP1304116 P.O.4514741558 WET SINGLE WAFER CLEANING EQUIPMENT MODEL SU -3100 TOOL ID WDNSBCXB00SWCA202 INV195184 5 MICAP1304116 P.O.4514741558
2025-01-16 CNSVKKLM2412041 MICRON TECHNOLOGY INC 9192.0 kg 470500 12 COPPER CHEMICAL MECHANICAL POLISHER MAKER APPLIED MATERIALS MODEL REFLEXION LK TOOL ID AMLKBCB900 MICAP1303144 P.O.350128367 4 INV1941541
2025-01-16 CNSVKKLM2412039 MICRON TECHNOLOGY INC 11249.0 kg 848620 PHYSICAL VAPOR DEPOSITION SPUTTER MAKER APPL IED MATERIALS MODEL ENDURA 2 TOOL ID WNENB7 A100 HS CODE 8486.20 MICAP1303432 P.O.350 1283673 INV1942271 PHYSICAL VAPOR DEPOSITION SPUTTER MAKER APPL IED MATERIALS MODEL ENDURA 2 TOOL ID WNENB7 A100 HS CODE 8486.20 MICAP1303432 P.O.350 1283673 INV1942271 PHYSICAL VAPOR DEPOSITION SPUTTER MAKER APPL IED MATERIALS MODEL ENDURA 2 TOOL ID WNENB7 A100 HS CODE 8486.20 MICAP1303432 P.O.350 1283673 INV1942271
2024-05-10 CNSVKKLM2404013 MICRON TECHNOLOGY INC 9882.0 kg 847149 001 WET PLATING AND CLEAN SYSTEM, MAKER APPL 486.20 001 WET PLATING AND CLEAN SYSTEM, MAKER APPL 486.20
2023-10-08 GPBBKEOAK2309001 CAPITAL ASSET EXCHANGE AND TRADE 5420.0 kg 848620 12 SEMICONDUCTOR EDUIPMENT LAM ETCHER SYSTEM MODEL: 2300 KIYO HS CODE: 8486.20
2023-04-28 CNSVBKEOA3040001 MICRON TECHNOLOGY INC 12114.0 kg 848620 12 SEMICONDUCTOR EQUIPMENT AMAT ETCHER SYSTE 5348 INV1728499 HS CODE8486.20 . 12 SEMICONDUCTOR EQUIPMENT AMAT ETCHER SYSTE 5348 INV1728499 HS CODE8486.20 . 12 SEMICONDUCTOR EQUIPMENT AMAT ETCHER SYSTE 5348 INV1728499 HS CODE8486.20 .
2022-10-31 CNSVKKLM2209040 MICRON TECHNOLOGY INC 4733.0 kg 903180 SEM - CRITICAL DIMENSION (CD) MEASUREMENT MOD3500854827 HS CODE9031.80 .
2022-09-22 CNSVKSEA2207016 MICRON TECHNOLOGY INC 25342.0 kg 848620 MEDIUM CURRENT ION IMPLANTER MODELVIISTA 810 HS CODE8486.20 . MEDIUM CURRENT ION IMPLANTER MODELVIISTA 810 HS CODE8486.20 . MEDIUM CURRENT ION IMPLANTER MODELVIISTA 810 HS CODE8486.20 .
2022-09-22 CNSVKSEA2207018 MICRON TECHNOLOGY INC 9049.0 kg 848620 12SEMICONDUCTOR EQUIPMENT AMAT PLASMA ETCHIN 3382 P.O.4510848437 HS CODE8486.20 . 12SEMICONDUCTOR EQUIPMENT AMAT PLASMA ETCHIN 3382 P.O.4510848437 HS CODE8486.20 .
2022-08-27 KWEO594040688273 TEXAS INSTRUMENTS INCORPORATED 13172.0 kg 470500 CHEMICAL MECHANICAL PLANARIZATION (CMP) CHEMICAL MECHANICAL PLANARIZATION (CMP)
2022-08-11 CNSVKSEA2206001 MICRON TECHNOLOGY INC 9278.0 kg 854389 TIN CHEMICAL VAPOR DEPOSITION INV NO.1614388 6.20 . TIN CHEMICAL VAPOR DEPOSITION INV NO.1614388 6.20 .
2022-08-10 OSTITPOAK2260648 SPT MICROTECHNOLOGIES USA INC 6316.0 kg 848620 VERTICAL DIFFUSION FURNACE MODEL RVP 300 HS CODE 8486 20 ACCORDING TO SHIPPER THIS WOOD USED IN THE PACKING HAS BEEN MANUFACTURED IN ACCORDANCE WITH IPPC STANDARDS SCAC CODE OSTI AMS B L OSTITPOAK2260648
2022-08-03 OSTITPOAK2260563 SPT MICROTECHNOLOGIES USA INC 6286.0 kg 848620 VERTICAL DIFFUSION FURNACE MODEL RVP 300 HS CODE 8486 20 ACCORDING TO SHIPPER THIS WOOD USED IN THE PACKING HAS BEEN MANUFACTURED IN ACCORDANCE WITH IPPC STANDARDS SCAC CODE OSTI AMS B L OSTITPOAK2260563
2022-07-28 NMCLKSEA2205010 MICRON TECHNOLOGY INC 9576.0 kg 854389 TIN CHEMICAL VAPOR DEPOSITION TIN CHEMICAL VAPOR DEPOSITION (APPARATUS FOR .
2022-07-22 CNSVKSEA2205030 MICRON TECHNOLOGY INC 4508.0 kg 841610 VERTICAL DIFFUSION FURNACE INV1615727 MICAP . . VERTICAL DIFFUSION FURNACE INV1615727 MICAP . .
2022-07-11 CNSVKSEA2206028 MICRON TECHNOLOGY INC 7900.0 kg 841610 VERTICAL DIFFUSION FURNACE MODELQUIXACE II P . . VERTICAL DIFFUSION FURNACE MODELQUIXACE II P . .
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NO 667 FUHSING 3RD RD HWA-YA TECHNOLOGY PARK GUISHAN DIST
NO 667 FUHSING 3RD RD HWA YA TECHNOLOGY PARK GUISHAN DIST TAOYUAN CITY 3 3383 TAIWAN
NO 667 FUHSING 3RD RD HWA-YA TECHNOLOGY PARK GUISHAN DIST
NO 667 FUHSING 3RD RD HWA YA TECHNOLOGY PARK GUISHAN DIST
NO 667 FUHSING 3RD RD HWA-YA TECHNOLOGY PARK
NO 667 FUHSING 3RD RD HWA YA TE CHNOLOGY PARK GUISHAN DIST TAOYU AN CITY 33383 TAIWAN
NO 667 FUHSING 3RD RD HWA YA TE CHNOLOGY PARK GUISHAN DIST TAOY UAN CITY 33383 TAIWAN
NO 667 FUHSING 3RD RD HWA-YA TE CHNOLOGY PARK
NO 667 FUHSING 3RD RD HWA-YA TE CHNOLOGY PARK GUISHAN DIST TAOYU AN CITY 33383 TAIWAN
NO 667 FUHSING 3RD RD HWA-YA TE CHNOLOGYPARK GUISHAN DIST TAOYUA N CITY 33383 TAOYUAN TW
NO 667 FUHSING 3RD RD HWA-YA TECHNOLOGY PARK
NO 667 FUHSING 3RD RD HWA-YA TECHNOLOGY PARK GUISHAN DIST TAOYUAN CITY 33383 TAIWAN
NO667 FUHSING 3RD RD HWA-YA TECHNOLOGY PARK GUISHAN DIST