| 2025-10-24 |
CMDUCHN2724231 |
INVENTEC ON BEHALF OF HP INC |
12507.0 kg |
292149.0
|
ASSEMBLY,MEDIA CARD READER, PROONE G ASSEMBLY,CABLE, . M USB IN CFD WHT ASSEMBLY,INTGRTD CAM DM MP ACS ASSEMBLY,KAZAAM W UMA N-KVM/TOUCH/N- ASSEMBLY,HUB,POSSUM ASSEMBLY,BASE UNIT,CAMERA,LANDSCAPE, . ASSEMBLY,HEATSINK CPU W, Z G MINI ASSEMBLY,NOT INCLUDED |
| 2025-10-24 |
CMDUCHN2724228 |
INVENTEC ON BEHALF OF HP INC |
11416.0 kg |
722870.0
|
ASSEMBLY,SSA,L . W UMA T,PROONE AI ASSEMBLY,SSA,L . W UMA NT,PROONE AI ASSEMBLY,PCI BULKHEAD BKT, A /A , Z ASSEMBLY,CAVITY ANTENNA ASSEMBLY,SSA,L . W U NT,PROONE M G ASSEMBLY,KAZAAM W UMA N-KVM/N-TOUCH/ ASSEMBLY,L Z MINI G I WKS ASSEMBLY,CPU HEATSINK W, Z |
| 2025-10-24 |
CMDUCHN2669091 |
INVENTEC ON BEHALF OF HP INC |
6361.0 kg |
381230.0
|
ASSEMBLY,KAZAAM W UMA N-KVM/N-TOUCH/ ASSEMBLY,JUMMANJI W UMA/N-TOUCH/ MP ASSEMBLY,SSA,L . W UMA NT,PROONE AI PART NO: P - P - N - PO : INV: H H H HS CODE: DELIVERY: SHIPMENT : CARTONS INTO PALLETS HPI-FTZ ONLY ALL CHARGES COLLECT AT USA BY HP USA |
| 2025-10-12 |
GSDRHZMSH356000 |
AMAZON FULFILLMENT CENTERS |
19540.0 kg |
844831.0
|
MEMORY CARD READER |
| 2025-10-12 |
GSDRHZMSH780000 |
AMAZON FULFILLMENT CENTERS |
16931.0 kg |
844831.0
|
MEMORY CARD READER |
| 2025-10-09 |
CMDUCHN2630621 |
HP INC |
12105.0 kg |
292149.0
|
ASSEMBLY,CPU HEATSINK W, Z G I MINI ASSEMBLY,INTGRTD CAM DM MP IR ACS ASSEMBLY,WEBCAM INTEGRATED, MIR+CLS TNR, ASSEMBLY,INTGRTD CAM DM MP ACS ASSEMBLY,JUMANJI -MISC NO WEBCAM ASSEMBLY,KAZAAM W UMA N-KVM/N-TOUCH/ ASSEMBLY,KAZAAM W UMA N-KVM/N-TOUCH/ ASSEMB |
| 2025-10-09 |
CMDUCHN2630615 |
INVENTEC ON BEHALF OF HP INC |
6158.0 kg |
721610.0
|
ASSEMBLY,NOT INCLUDED CARD READER, PROON ASSEMBLY,NON WEBCAM,PROONE G ASSEMBLY,NO INCLUDED ODD, PROONE G ASSEMBLY,L Z MINI G I WKS ASSEMBLY,HUB,POSSUM ASSEMBLY,HUB,POSSUM ASSEMBLY,HUB,POSSUM ASSEMBLY,L Z MINI G I WKS PART NO: L - M - M - P - N - N - N - P |
| 2025-10-03 |
CMDUCHN2608552 |
HP INC |
7417.0 kg |
721633.0
|
SET,BEZEL,DISPLAY,RGB, P BRACKET,TOP,KEYBOARD,SGCC,AMD BRACKET,TOP KB,AMD,SGCC, P CONNECTOR,W TO B, . / . MM,FL, . A,BLK, CONNECTOR,W TO B, . / . MM,ML,NTU, X IC,POWER SWITCH, . . V,SOT- - , P,TR TRANSISTOR-FET,NEMOS, V, . A,DFN - HINGE-W BRACKET,DISPLAY, |
| 2025-09-18 |
CMDUCHN2617017 |
HP INC |
11961.0 kg |
292149.0
|
ASSEMBLY,JUMANJI W UMA/TOUCH/ MP ASSEMBLY,HUB,POSSUM ASSEMBLY,KAZAAM W UMA N-KVM/N-TOUCH/ ASSEMBLY,NO INCLUDED ODD, PROONE G ASSEMBLY,CPU HEATSINK W, Z G I MINI ASSEMBLY,CPU HEATSINK W, Z G I MINI ASSEMBLY,CAVITY ANTENNA ASSEMBLY,KAZAAM W UMA N-KVM/TOUCH/ |
| 2025-09-18 |
CMDUCHN2617012 |
HP INC |
12067.0 kg |
721633.0
|
ASSEMBLY,HEATSINK CPU W, Z G MINI ASSEMBLY,JUMMANJI W UMA/N-TOUCH/ MP ASSEMBLY,HUB,POSSUM ASSEMBLY,SLIM,VESA SR,B,ENGAGE PRO ASSEMBLY,L Z MINI G I WKS ASSEMBLY,FRAME,HUB SURROUND,BLACK ASSEMBLY,KAZAAM W UMA N-KVM/N-TOUCH/ ASSEMBLY,KAZAAM W UMA KVM/N-TOUCH |
| 2025-09-18 |
CMDUCHN2617014 |
HP INC |
10620.0 kg |
721633.0
|
ASSEMBLY,SSA,L . W UMA NT,PROONE AI ASSEMBLY,SSA,L . W UMA T,PROONE AI ASSEMBLY,NOT INCLUDED CARD READER, PROON ASSEMBLY,KAZAAM W UMA N-KVM/N-TOUCH/ ASSEMBLY,MEDIA CARD READER, PROONE G ASSEMBLY,M. G /G SSD, PROG AIO ASSEMBLY,ODD KIT, PROONE G ASSEMBLY,L |
| 2025-09-11 |
CMDUCHN2616193 |
INVENTEC ON BEHALF OF HP INC |
11929.0 kg |
721633.0
|
ASSEMBLY,L Z MINI G I RSC WKS ASSEMBLY,BASE UNIT,DIS,NEW RISER CAGE ASSEMBLY,SLIM,VESA SR,B,ENGAGE PRO ASSEMBLY,HUB,POSSUM ASSEMBLY,BASE UNIT,CAMERA,LANDSCAPE, . ASSEMBLY,BASE UNIT,PORTRAIT, . ,WHITE ASSEMBLY,PCI BULKHEAD BKT, A /A , Z ASSEMBLY,NO INCLUDE |
| 2025-09-11 |
CMDUCHN2603110 |
HP INC |
10626.0 kg |
721633.0
|
ASSEMBLY,PCI BULKHEAD BKT, T , Z G M ASSEMBLY,FRAME,HUB SURROUND,BLACK ASSEMBLY,USB . GEN ,COIL, CM-SM V/ A, . ASSEMBLY,L Z MINI G I WKS ASSEMBLY,NOT INCLUDED CARD READER, PROON ASSEMBLY,MEDIA CARD READER, PROONE G ASSEMBLY,M. G /G SSD, PROG AIO ASSEMBLY, |
| 2025-08-28 |
CMDUCHN2511676 |
IEC TECHOLOGIES S DE R L DE C V |
6695.0 kg |
847010.0
|
BRACKET,TOP KLOCK,SUS SHIELD,DDR,SUS SHIELD,DDR,SUS ,WWAN ASSEMBLY,CASE,DISPLAY, WLAN NON TH,KIT,BL ASSEMBLY,MODULE,REAR, DISPLAY,WLAN DBTS, SEE A ATTACHMENT TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E. IMPERIAL HIGHWAY, SUITE F , SANTA FE S |
| 2025-08-21 |
CMDUCHN2483915 |
INVENTEC ON BEHALF OF HP INC |
10401.0 kg |
847330
|
ASSEMBLY,SSA,L6.5 65W UMA 24NT,PROONE AI ASSEMBLY,WEBCAM INTEGRATED, 5MIR+CLS TNR, ASSEMBLY,HEATSINK CPU 65W, Z2 G9 MINI ASSEMBLY,L6 Z2 MINI G1I WKS ASSEMBLY,CAVITY ANTENNA ASSEMBLY,NOT INCLUDED CARD READER, PROON ASSEMBLY,INTGRTD CAM DM 5MP ACS ASSEMBLY, |
| 2025-07-08 |
MAEU253765920 |
INVENTEC ON BEHALF OF HP INC |
6911.96 kg |
847150
|
ASSEMBLY,BASE UNIT, THIN CLI ENT,PUFFIN ASSEMBLY,BASE UNI T, THIN CLIENT,PUFFIN ASSE MBLY,CPU HEATSINK 65W, Z2 G1 I MINI ASSEMBLY,BASE UNIT, 15.6L,B,W/O NFC ASSEMBLY,SS A,L6.5 65W UMA 24 T, PROONE G ASSEMBLY,KAZAAM24 65W UM A N-KVM/N-TOUCH/ ASSEMBLY,IN TG |
| 2025-07-08 |
MAEU253765918 |
INVENTEC ON BEHALF OF HP INC |
7479.86 kg |
847180
|
ASSEMBLY,L6 Z2 MINI G1I WKS ASSEMBLY,CPU HEATSINK 125W, Z2 G1I MINI ASSEMBLY,KAZAAM2 4 65W UMA N-KVM/TOUCH/N- A SSEMBLY,JUMMANJI 65W UMA/N-T OUCH/5 MP ASSEMBLY,SSA,L6.5 65W UMA 24 T,PROONE AI ASS EMBLY,SSA,L6.5 65W UMA 24 T, PROONE AI ASSEMBLY,BASE UNIT , |
| 2025-07-03 |
CMDUCHN2269299 |
IEC TECHOLOGIES S DE R L DE C V |
6605.0 kg |
847330
|
ASSEMBLY,CASE,BOTTOM, UMA,THICK,WLAN,16P SET,COVER,TOP,PCR PART NO: H6256906 H6275451 PO : 4517465544 4517502272 INV: H629256906 H629275451 HS CODE: 8473309000 558 CARTONS INTO 22 PALLETS HPI-IMX - RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA 000557 |
| 2025-07-03 |
CMDUCHN2269302 |
IEC TECHOLOGIES S DE R L DE C V |
3480.0 kg |
847330
|
ASSEMBLY,CASE, BOTTOM,THIN,14P ASSEMBLY,CASE, BOTTOM,SUB,NRJ THIN-1,16 PART NO: H6276436 H6276475 PO : 4517506380 4517506419 INV: H629276436 H629276475 HS CODE: 8473309000 181 CARTONS INTO 10 PALLETS HPI-IMX - RAW MATERIALS ALL CHARGES COLLECT AT USA BY H |
| 2025-07-03 |
CMDUCHN2269318 |
IEC TECHOLOGIES S DE R L DE C V |
6439.0 kg |
847330
|
HINGE-W BRACKET,DISPLAY, LEFT,10.5 11.1KG HINGE-W BRACKET,DISPLAY, RIGHT,10.5 11.1K HINGE-W BRACKET,DISPLAY, LEFT,5.6 6.2KGF- HINGE-W BRACKET,DISPLAY, RIGHT,5.6 6.2KGF HINGE-W BRACKET,DISPLAY, LEFT,4.9 5.5KGF- HINGE-W BRACKET,DISPLAY, RIGHT,4.9 5.5KGF FAN |
| 2025-07-03 |
CMDUCHN2269301 |
IEC TECHOLOGIES S DE R L DE C V |
6543.0 kg |
854110
|
DIODE,ESD,5V,SMD, WLCSP 0.6X0.3-2,TR TRANSISTOR-FET,NEMOS, 30V,33A,DFN,8P,TR CONNECTOR,W TO B,8.33 /10.49MM,ML,BLK,2X6 INDUCTOR,15UH,+/-20 , 15.5A,11.8X10.5X10M CONNECTOR,FPC,BACK FLIP,1.06/1.06MM,FL,N CONNECTOR,B HEADER, 17.8MM,ML,BLK,2X6,STR CONNECTOR,R |
| 2025-07-03 |
CMDUCHN2269311 |
IEC TECHOLOGIES S DE R L DE C V |
6204.0 kg |
854129
|
TRANSISTOR-FET,NMOSFET, 60V,71A,DFN5,8P TRANSISTOR-FET,NMOSFET, 60V,71A,DFN5,8P PCB,KB,6L,FR4,HALOGEN FREE+ ROHS2 PCB,DISPLAY-I,6L,FR4, HALOGEN FREE+ ROHS2 PCB,SMART CARD,6L,FR4, HALOGEN FREE+ ROHS PCB,SD CARD,6L,FR4, HALOGEN FREE+ ROHS2 PCB,TRANS,6L,FR4, |
| 2025-07-03 |
CMDUCHN2269305 |
IEC TECHOLOGIES S DE R L DE C V |
8665.0 kg |
847330
|
SET,HOUSING,BOTTOM THERMAL MODULE,INTEL ARL-HX,MR NVIDIA,45 CABLE,ROUND,4POS,52MM, I,4PIN TO 4PIN SPEAKER.W/HOUSING,7OHM, 1.14W,11X34,95.85 SPEAKER.W/HOUSING,7OHM, 1.14W,11X34,74.2X MODULE,FINGER PRINT,SOFT GRAY TOUCH PAD,NO BUTTON,10P, 144X97.9,NOUVELL T |
| 2025-07-03 |
CMDUCHN2269316 |
IEC TECHOLOGIES S DE R L DE C V |
7228.0 kg |
854442
|
CABLE,ROUND,4POS,52MM, I,4PIN TO 4PIN MODULE,TOUCH CONTROL BOARD,WACOM KEYBOARD,83,PVCY BL, 42P,BLACK,USA,273.35 KEYBOARD,101,BL,42P, BLACK,USA,330.69X110 KEYBOARD,101,BL,42P, BLACK,USA,330.69X115 TOUCH PAD,NO BUTTON, 10P,144X88.07,PIKE S TOUCH PAD,NO BUT |
| 2025-07-03 |
CMDUCHN2269309 |
IEC TECHOLOGIES S DE R L DE C V |
12859.0 kg |
854129
|
TRANSISTOR-FET,NMOSFET, 60V,150A,DFN5,8P STANDOFF,FF,M2.0, 1.65MM,4.5MM,RND,SN,0.6 STANDOFF,FF,M2.0, 2.75MM,4.5MM,RND,SN,0.6 STANDOFF,FF,M2.0, 4.45MM,4.5MM,RND,SN,0.6 CABLE,ROUND,4POS, 52MM,I,4PIN TO 4PIN CABLE,ROUND,5POS, 52MM,I,POWER SWITCH FAN,BLOWER,1 |
| 2025-07-01 |
MAEU253257190 |
INVENTEC ON BEHALF OF HP INC |
12754.78 kg |
847330
|
ASSEMBLY,BASE UNIT, CAMERA,L ANDSCAPE,15.6 ASSEMBLY,BASE UNIT,NO CAMERA,LANDSCAPE,1 ASSEMBLY,BASE UNIT,THIN CLI ENT,PUFFIN ASSEMBLY,BASE UNI T,NO CAMERA,LANDSCAPE,1 AS SEMBLY,BASE UNIT, 19.5L,B,W/ O NFC ASSEMBLY,PCI BULKHEAD BKT, A1000/A400, Z ASSEMBL Y,B |
| 2025-07-01 |
MAEU253257194 |
INVENTEC ON BEHALF OF HP INC |
9255.25 kg |
847330
|
ASSEMBLY,KAZAAM24 65W UMA N- KVM/N-TOUCH/ ASSEMBLY,SSA,L6 .5 65W UMA 24NT,PROONE AI ASSEMBLY,SSA,L6.5 65W UMA 24 T,PROONE AI ASSEMBLY,INTGRT D CAM DM 5MP ACS ASSEMBLY, INTGRTD CAM DM 5MP IR ACS ASSEMBLY,MEDIA CARD READER, PROONE G9 ASSEMBLY,NO INCLUD ED O |
| 2025-06-26 |
CMDUCHN2269016 |
IEC TECHOLOGIES S DE R L DE C V |
10096.0 kg |
853400
|
PCB,MB,6L,FR4,HALOGEN FREE+ ROHS2 SPEAKER.W/HOUSING, 8OHM,1W,11.3X33.3,129. SPEAKER.W/HOUSING, 8OHM,1W,11.3X33.3,129. SPEAKER.W/HOUSING, 8OHM,1W,11X34,69.5X57. SPEAKER.W/HOUSING, 8OHM,1W,11X34,69.7X75. SPEAKER.W/HOUSING, 8OHM,1W,11X34,69.5X57. SPEAKER.W/H |
| 2025-06-26 |
CMDUCHN2269010 |
IEC TECHOLOGIES S DE R L DE C V |
7185.0 kg |
841459
|
FAN,BLOWER,75 73 10MM, 5.6CFM,92.16PA,5V, PCB,USB LAN,6L,FR4, HALOGEN FREE+ ROHS2 SET,FRAME,KEYBOARD, OFFLINE,US,14W SET,HINGE CAP,DISPLAY,14W ASSEMBLY,CASE,BOTTOM,WWAN,THIXO ASSEMBLY,CASE, BOTTOM,RJ45 THIN,14W SET,BOTTOM COVER,A ASSEMBLY,MODULE, REAR,DIS |
| 2025-06-26 |
CMDUCHN2269004 |
IEC TECHOLOGIES S DE R L DE C V |
6281.0 kg |
847330
|
ASSEMBLY,CASE,REAR, DISPLAY,WWAN,AG ASSEMBLY,CASE,REAR,DISPLAY ASSEMBLY,CASE,BOTTOM,THIN,14P ASSEMBLY,CASE,REAR, DISPLAY,WLAN,THICK,14 ASSEMBLY,BASE, KEYBOARD,SUB,US,14 ASSEMBLY,CASE,BOTTOM,THIN,14 PART NO: H6256926 H6256944 H6262707 H6262710 H6262714 H62 |
| 2025-06-26 |
CMDUCHN2247746 |
IEC TECHOLOGIES S DE R L DE C V |
6718.0 kg |
847330
|
ASSEMBLY,CASE,BOTTOM, SUB,NRJ THIN-1,16 ASSEMBLY,CASE,REAR, DISPLAY,WLAN,THIN,14P ASSEMBLY,CASE,REAR, DISPLAY,WLAN,THICK,14 ASSEMBLY,CASE,REAR, DISPLAY,WLAN,THICK,14 ASSEMBLY,CASE,REAR, DISPLAY,WLAN,16P,AL P ASSEMBLY,CASE, BOTTOM,THICK,14W PART NO: H62552 |
| 2025-06-26 |
CMDUCHN2247747 |
IEC TECHOLOGIES S DE R L DE C V |
6366.0 kg |
630539
|
BAG,FIBER,F,0.3MM,165MM,690MM CONTAINER,CUSHION, FORMED,WATER PULP,610M CARTON,DC,275PSI,BC, CG,667MM,112MM,182MM ASSEMBLY,KIT,REAR COVER,WLAN TH,16 ASSEMBLY,CASE, BOTTOM,W/O RJ45,14P ASSEMBLY,BASE, KEYBOARD,SUB,US,14 PART NO: H6277775 H6277777 H6277782 H |
| 2025-06-26 |
CMDUCHN2247738 |
IEC TECHOLOGIES S DE R L DE C V |
6302.0 kg |
847330
|
ASSEMBLY,BASE, KEYBOARD,SUB,US,14 ASSEMBLY,BASE, KEYBOARD,SUB,US,14 ASSEMBLY,BASE, KEYBOARD,SUB,UK,14 ASSEMBLY,BASE, KEYBOARD,SUB,UK,14 ASSEMBLY,BASE, KEYBOARD,SUB,UK,14 PART NO: H6276446 H6276448 H6276449 H6276450 H6276451 PO : 4517506390 4517506392 4517 |
| 2025-06-26 |
CMDUCHN2247737 |
IEC TECHOLOGIES S DE R L DE C V |
5947.0 kg |
847330
|
ASSEMBLY,CASE,REAR, DISPLAY,WWAN,THIN,14P ASSEMBLY,CASE,TOP,SUB,US ASSEMBLY,CASE,REAR, DISPLAY,WLAN,13X ASSEMBLY,CASE,REAR, DISPLAY,WWAN,13X ASSEMBLY,CASE,REAR, DISPLAY,WLAN,13X ASSEMBLY,CASE,REAR, DISPLAY,WWAN,13X SET,BEZEL,DISPLAY,IR,16 SET,BEZEL,DISPLA |
| 2025-06-26 |
CMDUCHN2247734 |
IEC TECHOLOGIES S DE R L DE C V |
7200.0 kg |
847160
|
KEYBOARD,83,PVCY BL, 42P,BLACK,USA,273.35 KEYBOARD,83,PVCY BL, 42P,BLACK,USA,273.32 KEYBOARD,101,PVCY BL, 42P,BLACK,USA,330.6 KEYBOARD,83,NON-BL, 42P,BLACK,CAN-FR / MU KEYBOARD,82,BL,42P, BLACK,USA,277.05X108. KEYBOARD,101,BL,42P, BLACK,USA,330.69X110 KEY |
| 2025-06-26 |
CMDUCHN2247742 |
IEC TECHOLOGIES S DE R L DE C V |
6737.0 kg |
847330
|
ASSEMBLY,CASE,REAR, DISPLAY,WLAN,THIN,14P ASSEMBLY,CASE,REAR, DISPLAY,WLAN,THICK,14 ASSEMBLY,CASE,REAR, DISPLAY,WLAN,THICK,14 ASSEMBLY,CASE,REAR, DISPLAY,WLAN,THIN,14W ASSEMBLY,CASE,REAR, DISPLAY,WLAN,THICK,14 PART NO: H6276453 H6276455 H6276456 H6276457 |
| 2025-06-26 |
CMDUCHN2247735 |
IEC TECHOLOGIES S DE R L DE C V |
8881.0 kg |
854442
|
CABLE,ROUND,24POS, 1000MM,I,USB TYPE C CABLE,ROUND,40POS, 164MM,I,EDP,2 LANE,TOP TOUCH PAD,NO BUTTON, 10P,144X88.07,NOUVEL MODULE,NFC MODULE,FINGER PRINT, NOUVELLE SILVER MODULE,FINGER PRINT, PIKE SILVER DIB,PEN,BLACK TOUCH PAD,NO BUTTON, 10P,138.5X77.7,N |
| 2025-06-26 |
CMDUCHN2244368 |
IEC TECHOLOGIES S DE R L DE C V |
7221.0 kg |
847330
|
ASSEMBLY,CASE,BOTTOM, RJ45 THICK,14W ASSEMBLY,CASE,REAR, DISPLAY,WLAN,13X TOUCH PAD,NO BUTTON, 10P,143.5X88.61,METE TOUCH PAD,NO BUTTON, 10P,144X88.07,PIKE S TRANSISTOR-FET,N-MOSFET, 30V,31.5A,PMPAK CAPACITOR-CHIP,4.7UF, 50V,K,X5R,0805,TR,1 DIODE,SCH,40V, |
| 2025-06-26 |
CMDUCHN2247741 |
IEC TECHOLOGIES S DE R L DE C V |
6312.0 kg |
847330
|
ASSEMBLY,CASE,REAR, DISPLAY,OLED WLAN,16W ASSEMBLY,BASE, KEYBOARD,SUB,US,14 ASSEMBLY,BASE, KEYBOARD,SUB,US,14 ASSEMBLY,BASE, KEYBOARD,SUB,US,14 ASSEMBLY,BASE, KEYBOARD,SUB,US,14 PART NO: H6276463 H6264638 H6264640 H6264641 H6276447 PO : 4517506407 4517482 |
| 2025-06-24 |
MAEU253237962 |
INVENTEC ON BEHALF OF HP INC |
10148.85 kg |
847330
|
ASSEMBLY,BASE UNIT, 15.6L,B, W/NFC ASSEMBLY,L6 Z2 MINI G1 I WKS ASSEMBLY,HUB,WOMBAT ASSEMBLY,BASE UNIT, 15.6L,B, W/NFC ASSEMBLY,BASE UNIT, 19.5L,B,W/NFC ASSEMBLY,BASE UNIT,CAMERA, LANDSCAPE,15.6 ASSEMBLY,L6 Z2 MINI G1I WKS ASSEMBLY,BASE UNIT,DIS ,NE W RISER CAGE ASSEMBLY,BASE U NIT, NO CAMERA,LANDSCAPE,2 ASSEMBLY,NOT INCLUDED CARD READER, PROON ASSEMBLY,NOT I NCLUDED CARD READER, PROON ASSEMBLY,MEDIA CARD READER, PROONE G9 ASSEMBLY,BASE UNI T, CAMERA,LANDSCAPE,19.5 A SSEMBLY,BASE UNIT, 19.5L,B,W /O NFC ASSEMBLY,WEBCAM INT EGRATED,5MIR+CLS TNR, ASSEMB LY,INTGRTD CAM DM 5MP IR ACS ASSEMBLY,JUMANJI24- FLEX IO HP PROSTUDIO ASSEMBLY,JUM ANJI24- FLEX IO BLANK ASSE MBLY,NO OPTIONAL 2ND I/O POR T, PROON PART NO: P17387-0 01 P17423-001 N60358-001 P17 387-001 P17535-001 M98116-001 P17423-001 M88041-004 N00149 -001 L92761-001 L92761-001 M 07406-001 M98117-001 P17537- 001 N31458-001 P22564-001 P2 3326-001 P47986-001 M97358-0 01 PO #: 4517482748 451750 5843 4517482709 4517482753 4 517482773 4517482700 4517505 845 4517505822 4517508037 45 17505738 4517505740 4517505743 4517508034 4517508132 45175 05755 4517505766 4517505771 4517505777 4517505751 INV: H629275517 H629278444 H6292 78464 H629278465 H629278466 H629278817 H629280352 H62928 2576 H629282594 H629283787 H 629283788 H629283789 H629284 912 H629287171 H629287176 H6 29287178 H629287179 H629287180 H629287181 HS CODE: 847 3309000 8471800000 852990420 0 DELIVERY: 4130426501 413 0434372 4130434416 413043441 7 4130434418 4130435219 4130 441317 4130446179 4130446235 4130448055 4130448056 4130448 057 4130453061 4130459483 41 30459512 4130459514 41304595 15 4130459516 4130459517 S HIPMENT #: 104408970 1044089 70 104408970 104408970 10440 8970 104408970 104408970 104 408970 104408970 104408970 1 04408970 104408970 104408970 104408970 104408970 1044089 70 104408970 104408970 10440 8970 390 CARTONS INTO 35 PAL LETS HPI-FTZ ONLY OCF/DEST INATION/LOCAL CHARGES COLLEC T AT USA BY HP USA SVC: 3310 1405359 |
| 2025-06-19 |
CMDUCHN2268929 |
IEC TECHOLOGIES S DE R L DE C V |
7112.0 kg |
854231
|
IC,STEP-DOWN REGULATOR, 5.5 24V,600KHZ,QF CAPACITOR-CHIP,4.7UF, 25V,K,X5R,0603,TR,0 CAPACITOR-CHIP,47UF, 6.3V,M,X5R,0603,TR,0 CAPACITOR-AL,150UF, 50V,M,-55 +105C,10X12 DIODE,SCH,100V,2A,SMD, MBS-2,TR IC,FLASH MEMORY,8M, -40 +85C,1.65 1.95V,1 IC,COLOR SENS |
| 2025-06-19 |
CMDUCHN2235966 |
IEC TECHOLOGIES S DE R L DE C V |
6493.0 kg |
847330
|
THERMAL MODULE,AMD FP7 U,UMA,28W,CHIPSET INSULATOR,WWAN,DFR-117 FOAM,DISPLAY PANEL, JS-LOC-B25,THICK,13 SHIELD,M/B,ABSORBER,0.35MM FOAM,DISPLAY PANEL, JS-LOC-B25,THIN,13 PAD,THERMAL,KB,0.1MM, GRAPHITE+CU,K=1500M FOAM,DISPLAY PANEL, JS-LOC-B25,THICK,13 BUM |
| 2025-06-19 |
CMDUCHN2268931 |
IEC TECHOLOGIES S DE R L DE C V |
11331.0 kg |
847330
|
SET,HOUSING,TOP,A SET,COVER,HINGE,16P SET,COVER,HINGE,13 SET,BEZEL,DISPLAY,IR,14W SET,BEZEL,DISPLAY,16P,IR SET,BEZEL,DISPLAY,16W,RGB SET,FRAME,KEYBOARD, OFFLINE,UK,14W SET,HINGE CAP,DISPLAY,14P SET,BEZEL,DISPLAY,RGB,14W CONNECTOR,FPC,BACK FLIP,1.95/1.95MM |
| 2025-06-19 |
CMDUCHN2268930 |
IEC TECHOLOGIES S DE R L DE C V |
10713.0 kg |
847330
|
SET,HOLDER,A DUMMY,SIM,TOP, PC+ABS+15 TALC FRAME,KEYBOARD,PC+ABS 15 TALC,UK,14P CABLE,ROUND,24POS, 1000MM,I,USB TYPE C CABLE,ROUND,24POS, 1000MM,I,USB TYPE C CABLE,ROUND,40POS, 164MM,I,EDP,2 LANE,TOP CABLE,ROUND+FPC, 30POS,215MM,I,HUB CABLE,FFC+CONN,40POS |
| 2025-06-19 |
CMDUCHN2268920 |
IEC TECHOLOGIES S DE R L DE C V |
5943.0 kg |
847330
|
SET,BEZEL,DISPLAY,RGB SET,BEZEL,DISPLAY,RGB,14P SET,BEZEL,DISPLAY,16W,IR ASSEMBLY,CASE,REAR, DISPLAY,WLAN,THICK,14 ASSEMBLY,CASE,REAR, DISPLAY,WWAN,THICK,14 ASSEMBLY,CASE,REAR, DISPLAY,WWAN,THICK,14 PART NO: H6265434 H6247549 H6247560 H6245795 H6255205 H6 |
| 2025-06-19 |
CMDUCHN2268926 |
IEC TECHOLOGIES S DE R L DE C V |
7335.0 kg |
847330
|
SET,HOLDER,A PART NO: H6265427 PO : 4517482911 INV: H629265427 HS CODE: 8473309000 400 CARTONS INTO 10 PALLETS HPI-IMX - RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA 0005579523 AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB8 TO INVENTEC M |
| 2025-06-19 |
CMDUCHN2268928 |
IEC TECHOLOGIES S DE R L DE C V |
6934.0 kg |
847330
|
SET,DISPLAY,BEZEL,IR,13 STANDOFF,FF,M2.0,1.65MM, 4.5MM,RND,SN,0.6 STANDOFF,FF,M2.0,4.45MM, 4.5MM,RND,SN,0.6 STANDOFF,FF,M2.5,11.53MM, 5.56MM,RND,SN,1 CLIP,5.6MM,1.34MM,0.15MM, SUS304 1/2H,H=1 PLATE,TOP TP,GLASS,16 BUMPER,DC,LED,SILICON RUBBER FOAM,LIGHTBA |
| 2025-06-19 |
CMDUCHN2247743 |
IEC TECHOLOGIES S DE R L DE C V |
8017.0 kg |
850650
|
SET,LI,3V,70MAH,CELL, CR1620,17X2 KEYBOARD,83,PVCY BL, 42P,BLACK,USA,273.35 KEYBOARD,83,NON-BL, 42P,BLACK,USA,273.35X KEYBOARD,83,PVCY BL, 42P,BLACK,USA,273.32 THERMAL MODULE,AMD FP7 U,UMA,28W,CHIPSET THERMAL MODULE,INTEL ADL U,UMA,15W,CHIPS THERMAL MODUL |
| 2025-06-19 |
CMDUCHN2247749 |
IEC TECHOLOGIES S DE R L DE C V |
6182.0 kg |
847330
|
ASSEMBLY,CASE,REAR,DISPLAY ASSEMBLY,CASE,REAR, DISPLAY,WLAN,THICK,14 ASSEMBLY,CASE,REAR, DISPLAY,WLAN,THICK,14 ASSEMBLY,CASE,TOP,SUB,US ASSEMBLY,CASE,REAR, DISPLAY,OLED WLAN,16W ASSEMBLY,CASE,BOTTOM, NRJ THIN-1,16 ASSEMBLY,CASE,BOTTOM, NRJ THIN-2,16N ASSE |
| 2025-06-19 |
CMDUCHN2247744 |
IEC TECHOLOGIES S DE R L DE C V |
11067.0 kg |
853690
|
CONNECTOR,USB3.0 GEN 2,TYPE A,-2.65/1.43 IC,RETIMER,3.0 3.6V, DP-ALT 2.1,USB 4,BGA SET,HOLDER,A ASSEMBLY,CASE,REAR, DISPLAY,WLAN,THICK,14 ASSEMBLY,CASE,REAR, DISPLAY,WWAN,16P ASSEMBLY,CASE,REAR, DISPLAY,WLAN,THICK,14 PART NO: H6255548 H6265050 H6265429 H6 |