| 2025-10-29 |
NXGWTYODDZ13176 |
DISCO HI TEC AMERICA INC |
622.0 kg |
847439.0
|
CHEMICAL PRODUCTS.N.E.S. |
| 2025-10-23 |
NXGWTYODDZ12863 |
DISCO HI TEC AMERICA INC |
1866.0 kg |
847439.0
|
CHEMICAL PRODUCTS.N.E.S. |
| 2025-10-11 |
NXGWTYODDJ83712 |
DISCO HI TEC AMERICA INC |
2670.0 kg |
846410.0
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2025-09-30 |
NXGWTYODDR43651 |
DISCO HI TEC AMERICA INC |
1244.0 kg |
847439.0
|
CHEMICAL PRODUCTS.N.E.S. |
| 2025-09-17 |
NXGWTYODDB55586 |
DISCO HI TEC AMERICA INC |
1866.0 kg |
847439.0
|
CHEMICAL PRODUCTS.N.E.S. |
| 2025-09-17 |
NXGWTYODDD76484 |
OPTO DIODE AN ITW COMPANY |
516.0 kg |
846410.0
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2025-09-10 |
NXGWTYODCL30030 |
DISCO HI TEC AMERICA INC |
1860.0 kg |
847439.0
|
CHEMICAL PRODUCTS.N.E.S. |
| 2025-09-04 |
NXGWTYODCW00986 |
DISCO HI TEC AMERICA INC |
1895.0 kg |
846410.0
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2025-08-25 |
NXGWTYODBX79743 |
HEXATECH INC |
3905.0 kg |
846410.0
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2025-07-24 |
NXGWTYODAX84210 |
DISCO HI TEC AMERICA INC |
1997.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2025-07-21 |
NXGWTYODBM63784 |
DISCO HI TEC AMERICA INC |
1248.0 kg |
847439
|
CHEMICAL PRODUCTS.N.E.S. |
| 2025-07-16 |
NXGWTYODAX19106 |
DISCO HI TEC AMERICA INC |
1240.0 kg |
847439
|
CHEMICAL PRODUCTS.N.E.S. |
| 2025-06-25 |
YUGLYLJ25324998 |
ARIZONA STATE UNIVERSITY |
20147.0 kg |
820780
|
FULLY AUTOMATIC IN FEED SURFACE GRINDER, HS CODE:820780 FULLY AUTOMATIC IN FEED SURFACE GRINDER, HS CODE:820780 |
| 2025-06-25 |
NXGWTYODAS64850 |
DISCO HI TEC AMERICA INC |
1273.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2025-06-11 |
NXGWTYOCZN46026 |
INTEL CORP |
5552.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, |
| 2025-06-06 |
NXGWTYOCZJ94202 |
DISCO HI TEC AMERICA INC |
683.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2025-06-06 |
NXGWTYOCZV90094 |
INTEL CORP |
13417.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, |
| 2025-06-04 |
NXGWTYOCZC38051 |
DISCO HI TEC AMERICA INC |
1240.0 kg |
847439
|
CHEMICAL PRODUCTS.N.E.S. |
| 2025-05-03 |
SHPT83279999 |
PURDUE UNIVERSITY |
3436.0 kg |
848620
|
AUTOMATIC SURFACE GRINDER HS CODE 848620 |
| 2025-05-02 |
NXGWTYOCYH88051 |
DISCO HI TEC AMERICA INC |
1240.0 kg |
847439
|
CHEMICAL PRODUCTS.N.E.S. |
| 2025-05-02 |
NXGWTYOCYN78951 |
INTEL CORP |
5566.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, |
| 2025-04-25 |
YUGLYLJ25313034 |
ARIZONA STATE UNIVERSITY |
3273.0 kg |
848620
|
AUTOMATIC DICING SAW, HS CODE:848620 |
| 2025-04-10 |
NXGWTYOCXT14575 |
INTEL CORP |
2943.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2025-03-26 |
NXGWTYOCXB11695 |
INTEL CORP |
5565.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, |
| 2025-03-26 |
NXGWTYOCXD51751 |
INTEL CORP |
2402.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2025-03-25 |
NXGWTYOCWT14036 |
DISCO HI TEC AMERICA INC |
1977.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2025-03-23 |
NXGWTYOCXJ57354 |
DISCO HI TEC AMERICA INC |
3920.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2025-03-23 |
NXGWTYOCXJ56105 |
DISCO HI TEC AMERICA INC |
3950.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2025-03-21 |
UASI3005089604 |
SPECTRUM CONTROL |
523.0 kg |
848620
|
AUTOMATIC DICING SAW HS CODE 848620 |
| 2025-03-14 |
HDMUTYOM950965A1 |
CORNELL UNIVERSITY ATTN LYNN CHARLE |
2319.0 kg |
847690
|
SHIPPER LOAD AND COUNT DWR1722 DEIONIZED WATER RECYCLING UNIT DAG8I0 AUTOMATIC SURFACE GRINDER |
| 2025-03-09 |
NXGWTYOCXE49014 |
DISCO HI TEC AMERICA INC |
1277.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2025-03-02 |
NXGWTYOCWG80772 |
DISCO HI TEC AMERICA INC |
1860.0 kg |
847439
|
CHEMICAL PRODUCTS.N.E.S. |
| 2025-02-20 |
NXGWTYOCVD35236 |
INTEL CORP |
13256.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2025-02-20 |
NXGWTYOCWD11253 |
INTEL CORP |
12894.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2025-02-07 |
DSVFOSA8224184 |
AMS OSRAM USA INC |
685.0 kg |
901320
|
(4 SKIDS)DISCOAUTOMATIC KABRA LASER SAWMODEL |
| 2025-02-07 |
DSVFOSA8223873 |
WOLFSPEED INC |
118.0 kg |
901320
|
(4 SKIDS)DISCOAUTOMATIC KABRA LASER SAWMODEL |
| 2025-02-05 |
NXGWTYOCVG77982 |
DISCO HI TEC AMERICA INC |
120.0 kg |
851410
|
MACHINERY, PLANT OR LABORATORY EQUIPMENT, WHETHER OR NOT ELECTRICALLY HEATED (EXCLUDING FURNACES, OVENS AND OTHER EQUIPMENT OF HEADING |
| 2025-01-10 |
TSJLYLJ24359014 |
SOUND TECHNOLOGY INC |
1999.0 kg |
848620
|
AUTOMATIC SURFACE GRINDER HS CODE 848620 |
| 2025-01-09 |
NXGWTYOCTX28053 |
DISCO HI TEC AMERICA INC |
3305.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2025-01-05 |
NXGWTYOCTZ65040 |
INTEL CORP |
14790.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2025-01-03 |
NXGWTYOCTL94152 |
DISCO HI TEC AMERICA INC |
5603.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2025-01-02 |
NXGWTYOCTE70720 |
INTEL CORP |
7342.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2025-01-02 |
NXGWTYOCTP70391 |
INTEL CORP |
12991.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2025-01-02 |
NXGWTYOCTK59313 |
INTEL CORP |
2404.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2025-01-02 |
NXGWTYOCTK61170 |
INTEL CORP |
2404.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2024-12-19 |
YATIYGLTYO105903 |
LINTEC OF AMERICA INC |
13001.0 kg |
851521
|
FULLY AUTOMATIC GRINDER FULLY AUTOMATIC GRINDER |
| 2024-12-12 |
NXGWTYOCTC95020 |
DISCO HI TEC AMERICA INC |
165.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2024-12-10 |
NXGWTYOCSY05645 |
INTEL CORP |
6924.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2024-12-10 |
NXGWTYOCSX05232 |
DISCO HI TEC AMERICA INC |
684.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2024-12-06 |
NXGWTYOCSR48341 |
INTEL CORP |
2366.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |