| Shipment Reliability and Frequency | Volume of Goods |
|---|---|
| Avg. Shipments per Month: 3.50 | Average TEU per month: 4.88 |
| Active Months: 12 | Average TEU per Shipment: 1.39 |
| Shipment Frequency Std. Dev.: 1.51 |
| Company Name | Shipments |
|---|---|
| FUTURE ELECTRONICS | 74 shipments |
| EMC CORP | 16 shipments |
| DANFOSS | 8 shipments |
| DIGI KEY CORP | 6 shipments |
| BOLD RENEWABLES LLC | 4 shipments |
| DELL EMC | 4 shipments |
| BOYD CORP | 3 shipments |
| EMC CHAMPAGNE HUB | 2 shipments |
| FUTURE ELECTRONICS DISTRIBUTION | 1 shipments |
| HS Code | Shipments |
|---|---|
| 251319 Pumice stone; emery; natural corundum, natural garnet and other natural abrasives, whether or not heat treated | 94 shipments |
| 251319.0 Pumice stone; emery; natural corundum, natural garnet and other natural abrasives, whether or not heat treated | 13 shipments |
| 841950 Heat exchange units; not used for domestic purposes | 6 shipments |
| 841950.0 Machinery, plant (not domestic), or laboratory equipment; electrically heated or not, (excluding items in 85.14) for the treatment of materials by a process involving change of temperature; including instantaneous or non electric storage water heaters | 2 shipments |
| 847330 Machinery; parts and accessories (other than covers, carrying cases and the like) of the machines of heading no. 8471 | 2 shipments |
| 850134 Electric motors and generators; DC, of an output exceeding 375kW | 1 shipments |
| Arrival Date | Bill Of Lading | Consignee | Weight | HS Code | Description |
|---|---|---|---|---|---|
| 2025-12-24 | DMALHKGC61227 | FUTURE ELECTRONICS | 1352.0 kg | 251319.0 | HEAT SINK |
| 2025-12-24 | DMALHKGC60725 | FUTURE ELECTRONICS | 285.0 kg | 251319.0 | HEAT SINK |
| 2025-12-13 | DMALSZXD21061 | DANFOSS | 97.0 kg | 251319.0 | HEAT SINK |
| 2025-12-12 | DMALHKGC60211 | FUTURE ELECTRONICS | 975.0 kg | 251319.0 | HEAT SINK |
| 2025-12-05 | DMALSZXD17691 | DANFOSS | 283.0 kg | 251319.0 | HEAT SINK |
| 2025-11-28 | DMALHKGC59164 | FUTURE ELECTRONICS | 189.0 kg | 251319.0 | HEAT SINK |
| 2025-11-20 | DMALHKGC58705 | FUTURE ELECTRONICS | 1590.0 kg | 251319.0 | HEAT SINK |
| 2025-11-20 | DMALHKGC58123 | FUTURE ELECTRONICS | 1402.0 kg | 251319.0 | HEAT SINK |
| 2025-11-12 | DMALHKGC57774 | FUTURE ELECTRONICS | 2170.0 kg | 251319.0 | HEAT SINK |
| 2025-11-02 | DMALSZXD13019 | EMC CORP | 597.0 kg | 841950.0 | COPPER & ALUMINUM HEAT SINK FOR SERVER THERMAL DISSIPATIONHS: INV NO # PLT S= CTNS |
| 2025-10-17 | DMALSZXD11156 | EMC CORP | 301.0 kg | 841950.0 | COPPER & ALUMINUM HEAT SINK FOR SERVER THERMAL DISSIPATION |
| 2025-10-10 | DMALHKGC56714 | FUTURE ELECTRONICS | 244.0 kg | 251319.0 | HEAT SINK |
| 2025-10-06 | DMALHKGC56186 | FUTURE ELECTRONICS | 198.0 kg | 251319.0 | HEAT SINK |
| 2025-10-02 | DMALHKGC55716 | FUTURE ELECTRONICS | 421.0 kg | 251319.0 | HEAT SINK |
| 2025-09-07 | DMALHKGC54590 | FUTURE ELECTRONICS | 204.0 kg | 251319.0 | HEAT SINK |
| 2025-08-24 | DMALHKGC50514 | FUTURE ELECTRONICS | 251.0 kg | 251319 | HEAT SINK |
| 2025-08-21 | DMALSZXC95636 | DANFOSS | 4170.0 kg | 251319 | HEAT SINK |
| 2025-08-03 | DMALSZXD00414 | BOYD CORP | 1560.0 kg | 251319 | HEAT SINK |
| 2025-08-02 | DMALHKGC51460 | FUTURE ELECTRONICS | 4550.0 kg | 251319 | HEAT SINK |
| 2025-07-28 | DMALSZXC98176 | EMC CORP | 614.0 kg | 841950 | COPPER & ALUMINUM HEAT SINK FOR SERVER THERMAL DISSIPATION |
| 2025-07-26 | DMALSZXC93606 | DANFOSS | 566.0 kg | 251319 | HEAT SINK |
| 2025-07-13 | DMALSZXC98303 | EMC CORP | 305.0 kg | 841950 | COPPER & ALUMINUM HEAT SINK FOR SERVER THERMAL DISSIPATION |
| 2025-07-11 | DMALSZXC89731 | DANFOSS | 283.0 kg | 251319 | HEAT SINK |
| 2025-06-09 | DMALHKGC48327 | FUTURE ELECTRONICS | 989.0 kg | 251319 | HEAT SINK |
| 2025-05-19 | DMALHKGC45491 | FUTURE ELECTRONICS | 267.0 kg | 251319 | HEAT SINK |
| 2025-05-17 | DMALHKGC46945 | FUTURE ELECTRONICS | 776.0 kg | 251319 | HEAT SINK |
| 2025-05-11 | DMALSZXC89051 | EMC CORP | 181.0 kg | 841950 | COPPER & ALUMINUM HEAT SINK FOR SERVER THERMAL DISSIPATION |
| 2025-05-10 | DMALHKGC47245 | FUTURE ELECTRONICS | 2375.0 kg | 251319 | HEAT SINK |
| 2025-05-09 | DMALHKGC46474 | FUTURE ELECTRONICS | 1084.0 kg | 251319 | HEAT SINK |
| 2025-05-01 | DMALHKGC45977 | FUTURE ELECTRONICS | 311.0 kg | 251319 | HEAT SINK |
| 2025-04-21 | DMALHKGC44947 | FUTURE ELECTRONICS | 266.0 kg | 251319 | HEAT SINK |
| 2025-04-20 | DMALSZXC85866 | EMC CORP | 250.0 kg | 841950 | COPPER & ALUMINUM HEAT SINK FOR SERVER THERMAL DISSIPATION |
| 2025-04-09 | DMALHKGC41259 | FUTURE ELECTRONICS | 368.0 kg | 251319 | HEAT SINK |
| 2025-03-26 | DMALHKGC43478 | FUTURE ELECTRONICS | 654.0 kg | 251319 | HEAT SINK |
| 2025-03-19 | DMALHKGC43138 | FUTURE ELECTRONICS | 187.0 kg | 251319 | HEAT SINK |
| 2025-03-05 | DMALHKGC41877 | FUTURE ELECTRONICS | 1631.0 kg | 251319 | HEAT SINK |
| 2025-02-20 | DMALSZXC78581 | DANFOSS | 1748.0 kg | 251319 | HEAT SINK |
| 2025-02-20 | DMALSZXC77165 | DANFOSS | 1748.0 kg | 251319 | HEAT SINK |
| 2025-02-16 | DMALHKGC41196 | FUTURE ELECTRONICS | 122.0 kg | 251319 | HEAT SINK |
| 2025-01-25 | DMALSZXC76538 | EMC CORP | 305.0 kg | 841950 | COPPER & ALUMINUM HEAT SINK FOR SERVER THERMAL DISSIPATION |
| 2025-01-11 | DMALHKGC38746 | FUTURE ELECTRONICS | 1768.0 kg | 251319 | HEAT SINK |
| 2025-01-10 | DMALSZXC74353 | EMC CORP | 912.0 kg | 841950 | COPPER & ALUMINUM HEAT SINK FOR SERVER THERMAL DISSIPATION |
| 2024-12-29 | DMALHKGC37774 | FUTURE ELECTRONICS | 213.0 kg | 251319 | HEAT SINK |
| 2024-12-20 | DMALHKGC37608 | FUTURE ELECTRONICS | 1002.0 kg | 251319 | HEAT SINK |
| 2024-12-14 | DMALSZXC70369 | EMC CORP | 428.0 kg | 251319 | HEAT SINK |
| 2024-12-06 | DMALHKGC36337 | FUTURE ELECTRONICS | 173.0 kg | 251319 | HEAT SINK |
| 2024-11-28 | DMALHKGC35301 | FUTURE ELECTRONICS | 323.0 kg | 251319 | HEAT SINK |
| 2024-11-28 | DMALHKGC35357 | FUTURE ELECTRONICS | 189.0 kg | 251319 | HEAT SINK |
| 2024-11-25 | DMALSZXC66782 | EMC CORP | 141.0 kg | 251319 | HEAT SINK |
| 2024-11-22 | DMALSZXC68122 | DANFOSS | 581.0 kg | 251319 | HEAT SINK |