| 2025-09-21 |
DMERKSY250800775 |
FFT INC |
1852.0 kg |
720250.0
|
SILICON WAFER . . . |
| 2025-09-11 |
NXGWFUKDCT09072 |
HAMADA RECTECH LTD |
2353.0 kg |
381800.0
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2025-08-13 |
NXGWFUKDBP25493 |
HAMADA RECTECH LTD |
2490.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2025-07-19 |
DMERKSY250600424 |
FFT INC |
1492.0 kg |
720250
|
M SILICON WAFER . . . |
| 2025-07-12 |
NXGWFUKDAP71234 |
HAMADA RECTECH LTD |
2444.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2025-06-13 |
NXGWFUKCZR31484 |
HAMADA RECTECH LTD |
2405.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2025-05-16 |
NXGWFUKCYP96055 |
HAMADA RECTECH LTD |
2426.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2025-05-15 |
NXGWTAOCYV41875 |
XIAN ESWIN MATERIAL TECHNOLOGY CO |
5867.0 kg |
842119
|
WAFER WAFER |
| 2025-04-11 |
NXGWFUKCXR63940 |
HAMADA RECTECH LTD |
1833.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2025-03-18 |
NXGWFUKCWV53180 |
HAMADA RECTECH LTD |
1924.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2025-02-14 |
NXGWFUKCVT39166 |
HAMADA RECTECH LTD |
1309.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2025-02-05 |
NXGWTAOCVW54723 |
XIAN ESWIN MATERIAL TECHNOLOGY CO |
2929.0 kg |
842119
|
WAFER |
| 2025-01-14 |
NXGWFUKCTW46434 |
HAMADA RECTECH LTD |
2225.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2025-01-07 |
NXGWTAOCTW30802 |
XIAN ESWIN MATERIAL TECHNOLOGY CO |
18964.0 kg |
842119
|
WAFER WAFER WAFER WAFER WAFER WAFER WAFER |
| 2024-12-31 |
NXGWTAOCTN43533 |
XIAN ESWIN MATERIAL TECHNOLOGY CO |
2937.0 kg |
842119
|
WAFER |
| 2024-12-14 |
NXGWFUKCTA02542 |
HAMADA RECTECH LTD |
1309.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2024-12-14 |
NXGWTSNCTB76071 |
XIAN ESWIN MATERIAL TECHNOLOGY CO |
12934.0 kg |
842119
|
WAFER WAFER WAFER WAFER WAFER |
| 2024-10-28 |
NXGWFUKCRH05624 |
HAMADA RECTECH LTD |
1269.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2024-09-12 |
NXGWFUKCPC28163 |
HAMADA RECTECH LTD |
1300.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
| 2024-07-19 |
ONEYTYOEA2216A01 |
VALQUA FFT INC |
1535.0 kg |
720250
|
SILICON WAFER |
| 2024-05-04 |
ONEYTYOE50190A01 |
VALQUA FFT INC |
1602.0 kg |
720250
|
SILICON WAFER |