| Shipment Reliability and Frequency | Volume of Goods |
|---|---|
| Avg. Shipments per Month: 0.29 | Average TEU per month: 0.46 |
| Active Months: 4 | Average TEU per Shipment: 1.38 |
| Shipment Frequency Std. Dev.: 0.47 |
| Company Name | Shipments |
|---|---|
| MEMC ELECTRONIC MATERIALS SPA | 9 shipments |
| MEMC JAPAN | 5 shipments |
| GLOBALWAFERS CO LTD | 1 shipments |
| JIA PIN PACKAGE DESIGN CO LTD | 1 shipments |
| MEMC ELECTRONIC MATERIALS SPA A GLOBALWAFERS COMPANY | 1 shipments |
| TAISIL ELECTRONIC MATERIALS CORP | 1 shipments |
| HS Code | Shipments |
|---|---|
| 381800 Chemical elements doped for use in electronics, in the form of discs, wafers or similar forms; chemical compounds doped for use in electronics : Chemical elements; doped for use in electronics, in the form of discs, wafers or similar forms; chemical compounds doped for use in electronics | 16 shipments |
| 842951 Bulldozers, graders, levellers, scrapers, angledozers, mechanical shovels, excavators, shovel loaders, tamping machines and road rollers, self-propelled : Front-end shovel loaders | 1 shipments |
| 854221 Electronic integrated circuits | 1 shipments |
| Arrival Date | Bill Of Lading | Shipper | Weight | HS Code | Description |
|---|---|---|---|---|---|
| 2025-06-06 | FTNVMLS000018767 | MEMC ELECTRONIC MATERIALS SPA | 206.0 kg | 381800 | LOADED INTO 1 PLT SILICON WAFERS ELECTRONIC MATERIAL HT CODE 38180010 |
| 2025-04-17 | FTNVMLS000018641 | MEMC ELECTRONIC MATERIALS SPA | 322.0 kg | 381800 | SILICON WAFERS ELECTRONIC MATERIAL HT CODE 38180010 |
| 2025-02-10 | FTNVMLS000018531 | MEMC ELECTRONIC MATERIALS SPA | 322.0 kg | 381800 | SILICON WAFERS ELECTRONIC MATERIAL HT CODE 38180010 |
| 2025-01-13 | FTNVTYS000003861 | MEMC JAPAN | 1350.0 kg | 381800 | S05QXB1ES0I100199 300MM DONOR FALLOUTTHS CODE381800 |
| 2024-01-16 | FTNVMLS000017558 | MEMC ELECTRONIC MATERIALS SPA | 413.0 kg | 381800 | SILICON WAFERS ELECTRONIC MATERIAL HT CODE 38180010 |
| 2023-11-11 | CSWAOAKCA00053 | MEMC ELECTRONIC MATERIALS SPA | 412.0 kg | 854221 | SILICON EPI WAFERS |
| 2023-10-17 | FTNVSTPES0000340 | JIA PIN PACKAGE DESIGN CO LTD | 390.0 kg | 842951 | 12 PP WAFER (FRONT/BACK)4 PLT= 48 CTNS |
| 2023-08-18 | FTNVTYS000003241 | MEMC JAPAN | 1350.0 kg | 381800 | SILICON POLISHED WAFERSSILICON EPI WAFERSDOPED FOR USE IN ELECTRONICS INDUSTRYHSCODE 381800 |
| 2023-06-18 | CSWAOAKCA00041 | MEMC ELECTRONIC MATERIALS SPA A GLOBALWAFERS COMPANY | 412.0 kg | 381800 | SILICON EPI WAFERS DOPED |
| 2023-05-16 | FTNVTYS000003133 | MEMC JAPAN | 1215.0 kg | 381800 | SILICON POLISHED WAFERSDOPED FOR USE IN ELECTRONICS INDUSTRYHS CODE 381800 |
| 2023-01-15 | FTNVTYS000002989 | MEMC JAPAN | 1215.0 kg | 381800 | SILICON POLISHED WAFERSDOPED FOR USE IN ELECTRONICS INDUSTRYINVOICE NO 90910399HS CODE 381800 |
| 2023-01-06 | NAQALOAK2205473V | MEMC ELECTRONIC MATERIALS SPA | 413.0 kg | 381800 | SILICON EPI WAFERS DOPED FOR USED IN ELECTRONICS INDUSTRY HS CODE 381800100 |
| 2021-12-20 | FTNVMLS000014995 | MEMC ELECTRONIC MATERIALS SPA | 413.0 kg | 381800 | INTO 2 PLTS SILICON EPI WAFERS DOPED FOR USE IN ELECTRONICS INDUSTRY HTS3818001000 . . . |
| 2021-11-14 | FTNVTPS000077112 | TAISIL ELECTRONIC MATERIALS CORP | 318.0 kg | 381800 | 200MM EPI EPI WAFERHS CODE 38180010148DN 80978699 |
| 2021-08-10 | FTNVMLS000014722 | MEMC ELECTRONIC MATERIALS SPA | 206.0 kg | 381800 | SILICON WAFERS HCODE 38180010 . |
| 2021-05-22 | FTNVTPS000074034 | GLOBALWAFERS CO LTD | 245.0 kg | 381800 | 200MMEPI EPI WAFERHS CODE38180010148DN80964270ON BOARD DATE MAY 012021 |
| 2021-04-18 | FTNVMLS000014242 | MEMC ELECTRONIC MATERIALS SPA | 206.0 kg | 381800 | INTO 1 PLT SILICON WAFERS HCODE 38180010 . |
| 2021-02-10 | FTNVTYS000002148 | MEMC JAPAN | 841.0 kg | 381800 | SILICON POLISHED WAFERSDOPED FOR USE IN ELECTRONICS INDUSTRYINVOICE NO90848052HS CODE381800 |