| 2026-03-27 |
SHPT90538662 |
IPS INDUSTRIE DES POUDRES SPHERIQUE |
1830.0 kg |
252520.0
|
SOLDER POWDER HS CODE |
| 2026-03-27 |
SEINSOATL26B2247 |
HARIMA CHEMICALS INC |
1493.0 kg |
252520.0
|
ALLOY SOLDER POWDER, RAW MATERIAL HS CODE: ., . |
| 2026-03-14 |
KWEO560240101592 |
HARIMATEC MALAYSIA SDN BHD |
608.0 kg |
731414.0
|
SOLDER WIRES (SILVER-SEMI MANUFACTURED) HS CODE: .. SOLDER WIRES (ELECTRODES) HS CODE: .. |
| 2026-03-14 |
KWEO560240102126 |
HARIMATEC MALAYSIA SDN BHD |
415.0 kg |
731414.0
|
SOLDER WIRES (SILVER-SEMI MANUFACTURED) HS CODE: .. SOLDER WIRES (ELECTRODES) HS CODE: .. LIQUID FLUX HS CODE: .. |
| 2026-03-04 |
SEINSOATL26A1177 |
HARIMA CHEMICALS INC |
1838.0 kg |
900120.0
|
ALLOY SOLDER POWDER, RAW MATERIAL, SECONDARY MATERIAL HS CODE : ., ., ., . |
| 2026-02-27 |
KWEO560240100586 |
HARIMATEC MALAYSIA SDN BHD |
660.0 kg |
854519.0
|
SOLDER WIRES (ELECTRODES) HS CODE: .. |
| 2026-01-29 |
YASVPRG0029835 |
HARIMATEC CZECH S R O |
4380.0 kg |
851519.0
|
BRAZING MATERIAL HYBRAZ MB HS: INV : FV, FVUN TOXIC LIQUID, PG , CLASS , KG |
| 2026-01-28 |
SEINSOATL25L2693 |
HARIMA CHEMICALS INC |
1687.0 kg |
252520.0
|
ALLOY SOLDER POWDER, RAW MATERIAL HS CODE : ., . |
| 2026-01-26 |
KWEO560240100170 |
HARIMATEC MALAYSIA SDN BHD |
1034.0 kg |
841382.0
|
LIQUID FLUX HS CODE: |
| 2026-01-26 |
KWEO560240100214 |
HARIMATEC MALAYSIA SDN BHD |
1812.0 kg |
200290.0
|
SC AGP SOLDER POWDER KG MY ISC AGP SOLDER POWDER KG MY L HS CODE: . . |
| 2026-01-17 |
KWEO560240100133 |
HARIMATEC MALAYSIA SDN BHD |
466.0 kg |
841382.0
|
LIQUID FLUX HS CODE: |
| 2026-01-16 |
KWEO560240099492 |
HARIMATEC MALAYSIA SDN BHD |
326.0 kg |
731414.0
|
SOLDER WIRES (SILVER-SEMI MANUFACTURED) HS CODE: . . SOLDER WIRES (ELECTRODES) HS CODE: . . |
| 2026-01-08 |
KWEO560240099573 |
HARIMATEC MALAYSIA SDN BHD |
218.0 kg |
731414.0
|
SOLDER WIRES (SILVER-SEMI MANUFACTURED) HS CODE: . . SOLDER WIRES (ELECTRODES) HS CODE: . . |
| 2025-12-31 |
KWEO560240098862 |
HARIMATEC MALAYSIA SDN BHD |
2047.0 kg |
841382.0
|
LIQUID FLUX HS CODE: . . |
| 2025-12-28 |
SEINSOATL25K0903 |
HARIMA CHEMICALS INC |
2200.0 kg |
252520.0
|
ALLOY SOLDER POWDER, RAW MATERIAL HS CODE: . , . , . , . |
| 2025-12-21 |
FLEQ01IPH0058644 |
HARIMATEC MALAYSIA SDN BHD |
576.0 kg |
731414.0
|
SOLDER WIRES (SILVER - SEMI MANUFACTURED) SOLDER WIRES (ELECTRODES) |
| 2025-12-10 |
FLEQ01IPH0058424 |
HARIMATEC MALAYSIA SDN BHD |
532.0 kg |
854519.0
|
SOLDER WIRES (ELECTRODES) |
| 2025-12-10 |
FLEQ01IPH0058539 |
HARIMATEC MALAYSIA SDN BHD |
509.0 kg |
731414.0
|
SOLDER WIRES (SILVER - SEMI MANUFACTURED) SOLDER WIRES (ELECTRODES) |
| 2025-12-03 |
SEINSOATL25J1686 |
HARIMA CHEMICALS INC |
2113.0 kg |
900120.0
|
ALLOY SOLDER POWDER, RAW MATERIAL, SECONDARY MATERIAL HS CODE: . , . , . , . |
| 2025-12-01 |
KWEO560240097624 |
HARIMATEC MALAYSIA SDN BHD |
1387.0 kg |
841382.0
|
LIQUID FLUX HS CODE: . . |
| 2025-11-24 |
FLEQ01IPH0058015 |
HARIMATEC MALAYSIA SDN BHD |
1426.0 kg |
831130.0
|
SOLDER WIRES & SOLDER POWDER SOLDER WIRES (SILVER - SEMI MANUFACTURED) & SOLDER WIRES (ELECTRODES) |
| 2025-11-21 |
SHPT90527838 |
IPS INDUSTRIE DES POUDRES |
3320.0 kg |
252520.0
|
SOLDER POWDER DANGEROUS SOLDER POWDER NON DANGEROUS HS CODE |
| 2025-10-29 |
SEINSOATL25I1676 |
HARIMA CHEMICALS INC |
2174.0 kg |
900120.0
|
ALLOY SOLDER POWDER, RAW MATERIAL, SECONDARY MATERIAL HS CODE : . , . |
| 2025-10-27 |
KWEO560240096460 |
HARIMATEC MALAYSIA SDN BHD |
2064.0 kg |
831130.0
|
SOLDER WIRE (SILVER-SEMI MANUFACTURED) HS CODE: . . SOLDER WIRES (ELECTRODES) HS CODE: . . |
| 2025-10-23 |
YASVPRG0029291 |
HARIMATEC CZECH S R O |
2613.0 kg |
851519.0
|
BRAZING MATERIAL HYBRAZ MB HS: INV : FV , FV UN TOXIC LIQUID, PG , CLASS , KG |
| 2025-10-10 |
FLEQ01IPH0057669 |
HARIMATEC MALAYSIA SDN BHD |
1075.0 kg |
252520.0
|
WOODEN CASES OF SOLDER POWDER SC AGP SOLDER POWDER KG MY ISC AGP SOLDER POWDER KG MY L |
| 2025-10-03 |
KWEO560240095605 |
HARIMATEC MALAYSIA SDN BHD |
3210.0 kg |
841382.0
|
LIQUID FLUX HS CODE: . . |
| 2025-09-27 |
KWEO560240095686 |
HARIMATEC MALAYSIA SDN BHD |
757.0 kg |
831130.0
|
SOLDER WIRE AND SOLDER POWDER HS CODE: . . , . . & . . |
| 2025-09-24 |
SEINSOATL25H0441 |
HARIMA CHEMICALS INC |
2061.0 kg |
252520.0
|
ALLOY SOLDER POWDER, RAW MATERIAL HS CODE : . , . , . |
| 2025-09-11 |
SHPT90519230 |
INDUSTRIE DES POUDRES SPHERIQUES |
2920.0 kg |
252520.0
|
POWDER HS CODE SOLDER POWDER |
| 2025-09-06 |
KWEO560240095082 |
HARIMATEC MALAYSIA SDN BHD |
419.0 kg |
841382.0
|
LIQUID FLUX HS CODE: . . |
| 2025-08-29 |
SEINSOATL25G1814 |
HARIMA CHEMICALS INC |
1821.0 kg |
900120.0
|
ALLOY SOLDER POWDER, RAW MATERIAL, SECONDARY MATERIAL HS CODE: . , . , . |
| 2025-08-18 |
KWEO560240094345 |
HARIMATEC MALAYSIA SDN BHD |
1714.0 kg |
831130
|
SOLDER WIRES LIQUID FLUX HS CODE: 8311.30.9900, 7106.92.0000 & 3810.90.0000 |
| 2025-08-02 |
YASVPRG0028699 |
HARIMATEC CZECH S R O |
6028.0 kg |
381090
|
BRAZING MATERIAL HYBRAZ 41 MB NHP-SW71-55ZNF HS: 38109010INV: FV2500141UN 3287 TOXIC LIQUID, PG 2, CLASS 6.1. |
| 2025-07-29 |
SHPT90512688 |
IPS INDUSTRIE DES POUDRES |
3070.0 kg |
800120
|
SOLDER POWDER SOLDER POWDER HS CODE 80012000 71061000 80070080 |
| 2025-07-26 |
KWEO560240093903 |
HARIMATEC MALAYSIA SDN BHD |
444.0 kg |
710692
|
SOLDER WIRES HS CODE: 7106.92.0000 & 8311.30.9900 |
| 2025-07-23 |
SEINSOATL25F1385 |
HARIMA CHEMICALS INC |
1892.0 kg |
800700
|
ALLOY SOLDER POWDER, RAW MATERIAL, SECONDARY MATERIAL HS CODE: 8007.00, 3906.90 |
| 2025-07-15 |
KWEO560240093833 |
HARIMATEC MALAYSIA SDN BHD |
1248.0 kg |
381010
|
SOLDER POWDER HS CODE: 3810.10.0000 |
| 2025-06-25 |
SEINSOATL25E0633 |
HARIMA CHEMICALS INC |
1642.0 kg |
800700
|
ALLOY SOLDER POWDER, RAW MATERIAL HS CODE: 8007.00 AND 3906.90 |
| 2025-06-23 |
FMMN01IPH0055405 |
HARIMATEC MALAYSIA SDN BHD |
4588.0 kg |
381090
|
1 X 20 GP CONTAINER STC 21 WOODEN CASES OF LIQUID FLUX HS CODE 3810 90 0000 UN1219 CLASS 3 PG 11 UN1993 CLASS 3 PG 11 |
| 2025-06-15 |
KWEO560240093424 |
HARIMATEC MALAYSIA SDN BHD |
1495.0 kg |
710692
|
SOLDER WIRES HS CODE: 7106.92.0000 & 8311.30.9900 |
| 2025-06-04 |
SEINSOATL25D0948 |
HARIMA CHEMICALS INC |
1086.0 kg |
800700
|
ALLOY SOLDER POWDER, RAW MATERIAL, SECONDARY MATERIAL HS CODE: 8007.00, 3926.90 |
| 2025-05-06 |
KWEO560240092190 |
HARIMATEC MALAYSIA SDN BHD |
820.0 kg |
710692
|
SOLDER WIRES HS CODE: 7106.92.0000 & 8311.30.9900 |
| 2025-04-25 |
SEINSOATL25C1180 |
HARIMA CHEMICALS INC |
1846.0 kg |
800700
|
ALLOY SOLDER POWDER, RAW MATERIAL HS CODE:8007.00, 2917.19, 2933.39 |
| 2025-04-21 |
KWEO560240091442 |
HARIMATEC MALAYSIA SDN BHD |
583.0 kg |
381010
|
90ISC DAP SOLDER POWDER 5KG MY L 90ISC AGP SOLDER POWDER 5KG MY L HS CODE: 3810.10.0000 |
| 2025-04-04 |
KWEO560240091151 |
HARIMATEC MALAYSIA SDN BHD |
612.0 kg |
710692
|
SOLDER WIRES HS CODE: 7106.92.0000 & 8311.30.9900 |
| 2025-03-29 |
SEINSOATL25B1318 |
HARIMA CHEMICALS INC |
1974.0 kg |
800700
|
ALLOY SOLDER POWDER, RAW MATERIAL, SECONDARY MATERIAL HS CODE:8007.00, 8479.90,3906.90 |
| 2025-03-17 |
KWEO560240090694 |
HARIMATEC MALAYSIA SDN BHD |
1270.0 kg |
710692
|
SOLDER WIRES HS CODE: 7106.92.0000 & 8311.30.9900 |
| 2025-03-05 |
KWEO560240090101 |
HARIMATEC MALAYSIA SDN BHD |
634.0 kg |
710692
|
SOLDER WIRES HS CODE: 7106.92.0000 & 8311.30.9900 |
| 2025-03-02 |
SEINSOATL25A1450 |
HARIMA CHEMICALS INC |
3584.0 kg |
800700
|
ALLOY SOLDER POWDER, RAW MATERIAL HS CODE: 8007.00, 3906.90, 2909.49, 2933.39 |