| 2025-10-29 |
SEINSOATL25I1676 |
HARIMA CHEMICALS INC |
2174.0 kg |
900120.0
|
ALLOY SOLDER POWDER, RAW MATERIAL, SECONDARY MATERIAL HS CODE : . , . |
| 2025-10-27 |
KWEO560240096460 |
HARIMATEC MALAYSIA SDN BHD |
2064.0 kg |
831130.0
|
SOLDER WIRE (SILVER-SEMI MANUFACTURED) HS CODE: . . SOLDER WIRES (ELECTRODES) HS CODE: . . |
| 2025-10-23 |
YASVPRG0029291 |
HARIMATEC CZECH S R O |
2613.0 kg |
851519.0
|
BRAZING MATERIAL HYBRAZ MB HS: INV : FV , FV UN TOXIC LIQUID, PG , CLASS , KG |
| 2025-10-10 |
FLEQ01IPH0057669 |
HARIMATEC MALAYSIA SDN BHD |
1075.0 kg |
252520.0
|
WOODEN CASES OF SOLDER POWDER SC AGP SOLDER POWDER KG MY ISC AGP SOLDER POWDER KG MY L |
| 2025-10-03 |
KWEO560240095605 |
HARIMATEC MALAYSIA SDN BHD |
3210.0 kg |
841382.0
|
LIQUID FLUX HS CODE: . . |
| 2025-09-27 |
KWEO560240095686 |
HARIMATEC MALAYSIA SDN BHD |
757.0 kg |
831130.0
|
SOLDER WIRE AND SOLDER POWDER HS CODE: . . , . . & . . |
| 2025-09-24 |
SEINSOATL25H0441 |
HARIMA CHEMICALS INC |
2061.0 kg |
252520.0
|
ALLOY SOLDER POWDER, RAW MATERIAL HS CODE : . , . , . |
| 2025-09-11 |
SHPT90519230 |
INDUSTRIE DES POUDRES SPHERIQUES |
2920.0 kg |
252520.0
|
POWDER HS CODE SOLDER POWDER |
| 2025-09-06 |
KWEO560240095082 |
HARIMATEC MALAYSIA SDN BHD |
419.0 kg |
841382.0
|
LIQUID FLUX HS CODE: . . |
| 2025-08-29 |
SEINSOATL25G1814 |
HARIMA CHEMICALS INC |
1821.0 kg |
900120.0
|
ALLOY SOLDER POWDER, RAW MATERIAL, SECONDARY MATERIAL HS CODE: . , . , . |
| 2025-08-18 |
KWEO560240094345 |
HARIMATEC MALAYSIA SDN BHD |
1714.0 kg |
831130
|
SOLDER WIRES LIQUID FLUX HS CODE: 8311.30.9900, 7106.92.0000 & 3810.90.0000 |
| 2025-08-02 |
YASVPRG0028699 |
HARIMATEC CZECH S R O |
6028.0 kg |
381090
|
BRAZING MATERIAL HYBRAZ 41 MB NHP-SW71-55ZNF HS: 38109010INV: FV2500141UN 3287 TOXIC LIQUID, PG 2, CLASS 6.1. |
| 2025-07-29 |
SHPT90512688 |
IPS INDUSTRIE DES POUDRES |
3070.0 kg |
800120
|
SOLDER POWDER SOLDER POWDER HS CODE 80012000 71061000 80070080 |
| 2025-07-26 |
KWEO560240093903 |
HARIMATEC MALAYSIA SDN BHD |
444.0 kg |
710692
|
SOLDER WIRES HS CODE: 7106.92.0000 & 8311.30.9900 |
| 2025-07-23 |
SEINSOATL25F1385 |
HARIMA CHEMICALS INC |
1892.0 kg |
800700
|
ALLOY SOLDER POWDER, RAW MATERIAL, SECONDARY MATERIAL HS CODE: 8007.00, 3906.90 |
| 2025-07-15 |
KWEO560240093833 |
HARIMATEC MALAYSIA SDN BHD |
1248.0 kg |
381010
|
SOLDER POWDER HS CODE: 3810.10.0000 |
| 2025-06-25 |
SEINSOATL25E0633 |
HARIMA CHEMICALS INC |
1642.0 kg |
800700
|
ALLOY SOLDER POWDER, RAW MATERIAL HS CODE: 8007.00 AND 3906.90 |
| 2025-06-23 |
FMMN01IPH0055405 |
HARIMATEC MALAYSIA SDN BHD |
4588.0 kg |
381090
|
1 X 20 GP CONTAINER STC 21 WOODEN CASES OF LIQUID FLUX HS CODE 3810 90 0000 UN1219 CLASS 3 PG 11 UN1993 CLASS 3 PG 11 |
| 2025-06-15 |
KWEO560240093424 |
HARIMATEC MALAYSIA SDN BHD |
1495.0 kg |
710692
|
SOLDER WIRES HS CODE: 7106.92.0000 & 8311.30.9900 |
| 2025-06-04 |
SEINSOATL25D0948 |
HARIMA CHEMICALS INC |
1086.0 kg |
800700
|
ALLOY SOLDER POWDER, RAW MATERIAL, SECONDARY MATERIAL HS CODE: 8007.00, 3926.90 |
| 2025-05-06 |
KWEO560240092190 |
HARIMATEC MALAYSIA SDN BHD |
820.0 kg |
710692
|
SOLDER WIRES HS CODE: 7106.92.0000 & 8311.30.9900 |
| 2025-04-25 |
SEINSOATL25C1180 |
HARIMA CHEMICALS INC |
1846.0 kg |
800700
|
ALLOY SOLDER POWDER, RAW MATERIAL HS CODE:8007.00, 2917.19, 2933.39 |
| 2025-04-21 |
KWEO560240091442 |
HARIMATEC MALAYSIA SDN BHD |
583.0 kg |
381010
|
90ISC DAP SOLDER POWDER 5KG MY L 90ISC AGP SOLDER POWDER 5KG MY L HS CODE: 3810.10.0000 |
| 2025-04-04 |
KWEO560240091151 |
HARIMATEC MALAYSIA SDN BHD |
612.0 kg |
710692
|
SOLDER WIRES HS CODE: 7106.92.0000 & 8311.30.9900 |
| 2025-03-29 |
SEINSOATL25B1318 |
HARIMA CHEMICALS INC |
1974.0 kg |
800700
|
ALLOY SOLDER POWDER, RAW MATERIAL, SECONDARY MATERIAL HS CODE:8007.00, 8479.90,3906.90 |
| 2025-03-17 |
KWEO560240090694 |
HARIMATEC MALAYSIA SDN BHD |
1270.0 kg |
710692
|
SOLDER WIRES HS CODE: 7106.92.0000 & 8311.30.9900 |
| 2025-03-05 |
KWEO560240090101 |
HARIMATEC MALAYSIA SDN BHD |
634.0 kg |
710692
|
SOLDER WIRES HS CODE: 7106.92.0000 & 8311.30.9900 |
| 2025-03-02 |
SEINSOATL25A1450 |
HARIMA CHEMICALS INC |
3584.0 kg |
800700
|
ALLOY SOLDER POWDER, RAW MATERIAL HS CODE: 8007.00, 3906.90, 2909.49, 2933.39 |
| 2025-02-06 |
SEINSOATL24L1316 |
HARIMA CHEMICALS INC |
2117.0 kg |
800700
|
ALLOY SOLDER POWDER, RAW MATERIAL SECONDARY MATERIAL HS CODE:8007.00, 3906.90 |
| 2025-02-02 |
SHPT90445801 |
IPS INDUSTRIE DES POUDRES SPHERIQUE |
1040.0 kg |
800120
|
SOLDER POWDER HS CODE 80012000 |
| 2025-01-31 |
KWEO560240089272 |
HARIMATEC MALAYSIA SDN BHD |
3403.0 kg |
710692
|
SOLDER WIRES HS CODE: 7106.92.0000 & 8311.30.9900 97SC AGP SOLDER POWDER 5KG MY 90ISC AGP SOLDER POWDER 5KG MY L HS CODE: 3810.10.0000 |
| 2025-01-10 |
KWEO560240088406 |
HARIMATEC MALAYSIA SDN BHD |
2289.0 kg |
710692
|
SOLDER WIRES HS CODE: 7106.92.0000 & 8311.30.9900 97SC AGP SOLDER POWDER 5KG MY 90ISC AGP SOLDER POWDER 5KG MY L 90ISC DAP SOLDER POWDER 5KG MY L HS CODE: 3810.10.0000 |
| 2025-01-02 |
SEINSOATL24K2799 |
HARIMA CHEMICALS INC |
2516.0 kg |
800700
|
ALLOY SOLDER POWDER, RAW MATERIAL, SECONDARY MATERIAL HS CODE: 8007.00 AND 3906.90 |
| 2024-12-14 |
KWEO560240087706 |
HARIMATEC MALAYSIA SDN BHD |
1011.0 kg |
731414
|
SOLDER WIRES |
| 2024-12-10 |
SEINSOATL24J2236 |
HARIMA CHEMICALS INC |
5333.0 kg |
800700
|
ALLOY SOLDER POWDER, RAW MATERIAL, SECONDARY MATERIAL HS CODE:8007.00, 8001.20, 3906.90, 2917.19, 2909.49 & 2916.39 |
| 2024-12-02 |
KWEO560240087566 |
HARIMATEC MALAYSIA SDN BHD |
436.0 kg |
731414
|
SOLDER WIRES |
| 2024-11-20 |
KWEO560240087183 |
HARIMATEC MALAYSIA SDN BHD |
437.0 kg |
731414
|
SOLDER WIRES |
| 2024-11-10 |
YASVPRG0026973 |
HARIMATEC CZECH S R O |
6028.0 kg |
851519
|
BRAZING MATERIAL |
| 2024-10-09 |
NXGWPKGCPN80841 |
HARIMATEC MALAYSIA SDN BHD |
2795.0 kg |
711411
|
SILVER (INCLUDING SILVER PLATED WITH GOLD OR PLATINUM), UNWROUGHT OR IN SEMI-MANUFACTURED FORMS, OR IN POWDER FORM. |
| 2024-10-08 |
SEINSOATL24H1267 |
HARIMA CHEMICALS INC |
2798.0 kg |
800700
|
ALLOY SOLDER POWDER, RAW MATERIAL, SECONDARY MATERIAL HS CODE: 8007.00, 3906.90, 3926.90, 2933.39 |
| 2024-09-24 |
KWEO560240084991 |
HARIMATEC MALAYSIA SDN BHD |
1583.0 kg |
731414
|
SOLDER WIRES |
| 2024-09-21 |
SEINSOATL24G2127 |
HARIMA CHEMICALS INC |
3022.0 kg |
800700
|
ALLOY SOLDER POWDER, RAW MATERIAL, SECONDARY MATERIAL HS CODE: 8007.00, 3906.90 AND 3923.10 |
| 2024-08-24 |
SHPT90428082 |
IPS INDUSTRIE DES POUDRES SPHERIQUE |
2164.0 kg |
800700
|
SOLDER POWDER UN 3077 CLASS 9 PG III HS CODE 80070032 |
| 2024-07-29 |
SEINSOATL24F1022 |
HARIMA CHEMICALS INC |
5203.0 kg |
800700
|
ALLOY SOLDER POWDER, RAW MATERIAL, SECONDARY MATERIAL HS CODE:8007.00, 8001.20, 3906.90, 2909.49, 3806.10 |
| 2024-07-01 |
KWEO560240081815 |
HARIMATEC MALAYSIA SDN BHD |
330.0 kg |
731414
|
SOLDER WIRES & TTC LF CLEANER |
| 2024-06-28 |
SEINSOATL24E1848 |
HARIMA CHEMICALS INC |
2957.0 kg |
800700
|
ALLOY SOLDER POWDER, RAW MATERIAL HS CODE: 8007.00 AND 3906.90 |
| 2024-06-07 |
SEINSOATL24D2648 |
HARIMA CHEMICALS INC |
3054.0 kg |
800700
|
ALLOY SOLDER POWDER, RAW MATERIAL, SECONDARY MATERIAL HS CODE:8007.00, 3906.90, 2917.19, 3923.10, 3923.50 |
| 2024-05-17 |
YASVPRG0025915 |
HARIMATEC CZECH S R O |
6028.0 kg |
381090
|
BRAZING MATERIALHYBRAZ 41 MBNHP-SW71-55ZNFHS:38109010INV: FV23233UN 3287 TOXIC LIQUID, PG 2, CLASS 6.1. |
| 2024-05-09 |
KWEO560240080640 |
HARIMATEC MALAYSIA SDN BHD |
207.0 kg |
731414
|
SOLDER WIRES & TTC LF CLEANER |
| 2024-05-09 |
KWEO560240080275 |
HARIMATEC MALAYSIA SDN BHD |
967.0 kg |
731414
|
SOLDER WIRES & TTC LF CLEANER |